| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
Multim. Syst.
|
| 2026 | J | jnl |
Int. J. Mach. Learn. Cybern.
|
| 2026 | A* | conf |
AAAI
|
| 2026 | J | jnl |
Pattern Recognit.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Comput. Electron. Agric.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Complex Intell. Syst.
|
| 2025 | A* | conf |
MobiCom
|
| 2025 | J | jnl |
Int. J. Mach. Learn. Cybern.
|
| 2025 | J | jnl |
IEEE Consumer Electron. Mag.
|
| 2025 | J | jnl |
Artif. Intell. Rev.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
CVPR
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Expert Syst. J. Knowl. Eng.
|
| 2025 | A* | conf |
EMNLP
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Clust. Comput.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Appl. Soft Comput.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Appl. Math. Lett.
|
| 2025 | A* | conf |
INFOCOM
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Entropy
|
| 2024 | J | jnl |
Appl. Math. Lett.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2024 | — | conf |
ISWC (Posters/Demos/Industry)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Wirel. Commun.
|
| 2024 | J | jnl |
Artif. Intell. Rev.
|
| 2024 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2024 | A | conf |
ECAI
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | — | conf |
ECCV (68)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
SIAM J. Numer. Anal.
|
| 2023 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ICITE
|
| 2023 | C | conf |
IECON
|
| 2023 | A* | conf |
SIGGRAPH Asia
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
J. Comput. Des. Eng.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2023 | J | jnl |
Int. J. Secur. Networks
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Multim.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
ICCV
|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
J. Supercomput.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | A* | conf |
MobiCom
|
| 2021 | J | jnl |
ACM Trans. Web
|
| 2021 | B | conf |
IWQoS
|
| 2020 | J | jnl |
Proc. VLDB Endow.
|
| 2020 | Misc | conf |
SenSys
|
| 2020 | J | jnl |
Adv. Eng. Informatics
|
| 2017 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2017 | B | conf |
Petri Nets
|
| 2016 | A | conf |
CIKM
|
| 2009 | — | conf |
ESIAT (2)
|