| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2026 | J | jnl |
IEEE Internet Things J.
|
| 2026 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2026 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
Scientometrics
|
| 2025 | J | jnl |
Knowl. Inf. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
Behav. Inf. Technol.
|
| 2024 | J | jnl |
Sensors
|
| 2024 | A* | conf |
MICRO
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2024 | Misc | conf |
ICISC
|
| 2024 | — | conf |
ECCV (16)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ECCV (27)
|
| 2023 | J | jnl |
Expert Syst. Appl.
|
| 2023 | — | conf |
ICISC (1)
|
| 2023 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2023 | A* | conf |
CVPR
|
| 2023 | C | conf |
ICCD
|
| 2023 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2023 | J | jnl |
SIAM J. Matrix Anal. Appl.
|
| 2023 | A | conf |
DATE
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
AAAI
|
| 2022 | J | jnl |
Appl. Math. Comput.
|
| 2022 | — | conf |
KSEM (2)
|
| 2022 | J | jnl |
CoRR
|
| 2022 | Misc | conf |
ICASSP
|
| 2022 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2022 | J | jnl |
CoRR
|
| 2021 | — | conf |
ICARA
|
| 2021 | — | conf |
BCB
|
| 2021 | J | jnl |
Bioinform.
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2019 | J | jnl |
BMC Bioinform.
|
| 2018 | J | jnl |
Bioinform.
|
| 2015 | J | jnl |
BMC Bioinform.
|
| 2013 | C | conf |
IDEAL
|
| 2002 | C | conf |
CSCWD
|