| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | A | conf |
TDM Signal Grouping and Package Pin Assignment for 2.5D Multi-FPGA Systems with Lookahead Placement.
FPGA
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ISPD
|
| 2025 | A* | conf |
DAC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | A | conf |
ICCAD
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | — | conf |
ASP-DAC
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ASP-DAC
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
CoRR
|
| 2022 | A* | conf |
DAC
|
| 2021 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2021 | A* | conf |
DAC
|