| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Adv. Eng. Informatics
|
| 2024 | J | jnl |
Eng. Comput.
|
| 2024 | J | jnl |
Eng. Comput.
|
| 2024 | J | jnl |
Sci. Robotics
|
| 2024 | J | jnl |
J. Comput. Phys.
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
Eng. Comput.
|
| 2023 | J | jnl |
Eng. Comput.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Virtual Thermal Sensor for Real-Time Monitoring of Electronic Packages in a Totally Enclosed System.
IEEE Access
|
| 2021 | J | jnl |
Appl. Math. Comput.
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
CoRR
|
| 2020 | J | jnl |
Appl. Math. Comput.
|
| 2019 | J | jnl |
CoRR
|
| 2019 | — | conf |
AHFE (24)
|
| 2019 | J | jnl |
Appl. Math. Comput.
|