| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
J. Syst. Archit.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
NewCAS
|
| 2025 | J | jnl |
Data Knowl. Eng.
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
IJCNLP-AACL (Findings)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | Misc | conf |
FCCM
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Data Technol. Appl.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
UIST
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
NeurIPS
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
ICT Express
|
| 2024 | A* | conf |
MICRO
|
| 2024 | A* | conf |
MICRO
|
| 2024 | — | conf |
IISWC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Access
|
| 2023 | A* | conf |
CHI
|
| 2023 | — | conf |
MICCAI (2)
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | A* | conf |
ISCA
|
| 2023 | — | conf |
ICTC
|
| 2023 | A* | conf |
CHI
|
| 2023 | — | conf |
ACL (1)
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
VLSI Technology and Circuits
|
| 2023 | — | conf |
EMNLP (Findings)
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Data Technol. Appl.
|
| 2023 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2023 | Misc | conf |
ICASSP
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ICTC
|
| 2022 | — | conf |
ASP-DAC
|
| 2022 | — | conf |
CHIL
|
| 2022 | J | jnl |
CoRR
|
| 2022 | A* | conf |
MICRO
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Trans. Signal Process.
|
| 2021 | — | conf |
IC-NIDC
|
| 2021 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2021 | A* | conf |
MICRO
|
| 2021 | — | conf |
ML4H@NeurIPS
|
| 2021 | J | jnl |
CoRR
|
| 2021 | A* | conf |
HPCA
|
| 2020 | J | jnl |
J. Comput. Des. Eng.
|
| 2020 | B | conf |
PACT
|
| 2020 | A* | conf |
DAC
|
| 2019 | A* | conf |
DAC
|
| 2019 | — | conf |
GEM
|
| 2019 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2018 | — | conf |
COLING (Demos)
|
| 2018 | — | conf |
ISWC (P&D/Industry/BlueSky)
|
| 2018 | — | conf |
Semdeep/NLIWoD@ISWC
|
| 2018 | C | conf |
TENCON
|
| 2018 | — | conf |
Semdeep/NLIWoD@ISWC
|
| 2018 | — | conf |
ISWC (P&D/Industry/BlueSky)
|
| 2018 | — | conf |
COLING (Demos)
|
| 2017 | J | jnl |
IEICE Electron. Express
|
| 2015 | — | conf |
ISCE
|
| 2015 | C | conf |
ICCE
|
| 2013 | J | jnl |
Int. J. Distributed Sens. Networks
|
| 2012 | C | conf |
ICCE
|
| 2012 | C | conf |
ICCE
|
| 2010 | — | conf |
CCNC
|
| 2010 | — | conf |
CMCS@ETAPS
|
| 2009 | — | conf |
VTC Fall
|
| 2009 | — | conf |
VTC Fall
|
| 2009 | — | conf |
Wireless Days
|
| 2008 | — | conf |
AMAST
|
| 2008 | C | conf |
ISPA
|
| 2008 | C | conf |
ISPA
|
| 2007 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2007 | J | jnl |
IEICE Electron. Express
|
| 2006 | C | conf |
CIS
|
| 2005 | — | conf |
CICC
|
| 2005 | Misc | conf |
ICISC
|
| 2005 | — | conf |
CIS (2)
|
| 2005 | — | conf |
CISC
|