| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Future Gener. Comput. Syst.
|
| 2025 | J | jnl |
Connect. Sci.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
Swarm Evol. Comput.
|
| 2023 | J | jnl |
CAAI Trans. Intell. Technol.
|
| 2022 | — | conf |
ICCA
|
| 2021 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2020 | J | jnl |
A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature.
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
NLPCC (1)
|
| 2018 | J | jnl |
Microelectron. Reliab.
|