Jiaxing Hu

12 papers Journal 10Unranked 2
YearRankTypeTitle / Venue / Authors
2026 J jnl
Resource-Efficient joint clustering and storage optimization for blockchain-Based IoT systems.
Future Gener. Comput. Syst.
Kai Peng, Xueyan Hu, Jiaxing Hu, Zhiheng Yao, Tianping Deng, Menglan Hu, Chao Cai, Zehui Xiong
2025 J jnl
A novel CNN architecture for image restoration with implicit frequency selection.
Connect. Sci.
Jiaxing Hu, Zhibo Wang
2025 J jnl
Blockchain-Enhanced UAV Networks: Optimizing Data Storage for Real-Time Efficiency.
IEEE Internet Things J.
Tongxin Liao, Lan Wei, Xueyan Hu, Jiaxing Hu, Menglan Hu, Kai Peng, Chao Cai, Zehui Xiong
2024 J jnl
Clustering-Based Collaborative Storage for Blockchain in IoT Systems.
IEEE Internet Things J.
Kai Peng, Jiangshan Xie, Lan Wei, Jiaxing Hu, Xueyan Hu, Tianping Deng, Menglan Hu
2023 J jnl
A pairwise comparison based surrogate-assisted evolutionary algorithm for expensive multi-objective optimization.
Swarm Evol. Comput.
Ye Tian, Jiaxing Hu, Cheng He, Haiping Ma, Limiao Zhang, Xingyi Zhang
2023 J jnl
Knowledge-enriched joint-learning model for implicit emotion cause extraction.
CAAI Trans. Intell. Technol.
Chenghao Wu, Shumin Shi, Jiaxing Hu, Heyan Huang
2022 — conf
ResFi: WiFi-Enabled Device-Free Respiration Detection Based on Deep Learning.
ICCA
Jiaxing Hu, Jianfei Yang, Jenn-Bing Ong, Dazhuo Wang, Lihua Xie
2021 J jnl
Road-Network-Based Fast Geolocalization.
IEEE Trans. Geosci. Remote. Sens.
Yongfei Li, Dongfang Yang, Shicheng Wang, Hao He, Jiaxing Hu, Huaping Liu
2020 J jnl
A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature.
IEEE Access
Jiaxing Hu, Bo Jing, Yifeng Huang, Xiaoxuan Jiao, Meng Sun, Longteng Li
2020 J jnl
Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes.
IEEE Access
Longteng Li, Bo Jing, Jiaxing Hu, Xiaoxuan Jiao, Jinxin Pan, Hongda Sun
2019 — conf
Combining External Sentiment Knowledge for Emotion Cause Detection.
NLPCC (1)
Jiaxing Hu, Shumin Shi, Heyan Huang
2018 J jnl
Failure and failure characterization of QFP package interconnect structure under random vibration condition.
Microelectron. Reliab.
Jiaxing Hu, Bo Jing, Zengjin Sheng, Fang Lu, Yaojun Chen, Yulin Zhang