| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2026 | J | jnl |
Image Vis. Comput.
|
| 2026 | J | jnl |
Comput. Oper. Res.
|
| 2026 | J | jnl |
Digit. Signal Process.
|
| 2026 | J | jnl |
Future Gener. Comput. Syst.
|
| 2026 | A* | conf |
WWW
|
| 2026 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Trans. Biomed. Eng.
|
| 2026 | J | jnl |
Trans. Inst. Meas. Control
|
| 2026 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2026 | — | conf |
MMM (2)
|
| 2026 | J | jnl |
CoRR
|
| 2025 | B | conf |
IJCNN
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | — | conf |
ROBIO
|
| 2025 | J | jnl |
IEEE Signal Process. Lett.
|
| 2025 | J | jnl |
Symmetry
|
| 2025 | J | jnl |
Int. J. Prod. Res.
|
| 2025 | B | conf |
COLING
|
| 2025 | A* | conf |
CVPR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE J. Biomed. Health Informatics
|
| 2025 | — | conf |
EMNLP (Industry Track)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Comput. Networks
|
| 2025 | J | jnl |
IEEE Trans. Neural Networks Learn. Syst.
|
| 2025 | — | conf |
WHICEB (3)
|
| 2025 | J | jnl |
Circuits Syst. Signal Process.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Comput. Mater. Continua
|
| 2025 | J | jnl |
Appl. Soft Comput.
|
| 2025 | Misc | conf |
IDC
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Networks Heterog. Media
|
| 2025 | J | jnl |
Comput. Stat.
|
| 2025 | — | conf |
BDICN
|
| 2025 | — | conf |
HCI (35)
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
ICLR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
UGPhysics: A Comprehensive Benchmark for Undergraduate Physics Reasoning with Large Language Models.
ICML
|
| 2025 | J | jnl |
UGPhysics: A Comprehensive Benchmark for Undergraduate Physics Reasoning with Large Language Models.
CoRR
|
| 2024 | — | conf |
ICCVIT
|
| 2024 | J | jnl |
J. King Saud Univ. Comput. Inf. Sci.
|
| 2024 | J | jnl |
Sensors
|
| 2024 | — | conf |
HCI (66)
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | — | conf |
ICIC (LNAI 1)
|
| 2024 | — | conf |
EMNLP (Findings)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
ACM Multimedia
|
| 2024 | J | jnl |
Comput. Oper. Res.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | — | conf |
ISBI
|
| 2024 | J | jnl |
J. Frankl. Inst.
|
| 2024 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
EMNLP (Industry Track)
|
| 2024 | — | conf |
FAIML
|
| 2024 | J | jnl |
Sensors
|
| 2024 | B | conf |
IJCNN
|
| 2023 | J | jnl |
Comput. Oper. Res.
|
| 2023 | — | conf |
CNIOT
|
| 2023 | C | conf |
PRO-VE
|
| 2023 | J | jnl |
Comput. Biol. Medicine
|
| 2023 | J | jnl |
IEEE Trans. Commun.
|
| 2023 | J | jnl |
IET Commun.
|
| 2023 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2023 | J | jnl |
Wirel. Networks
|
| 2023 | — | conf |
ICMLCA
|
| 2023 | — | conf |
CCWC
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | — | conf |
MSN
|