| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
J. Chem. Inf. Model.
|
| 2026 | J | jnl |
IEEE Open J. Commun. Soc.
|
| 2026 | J | jnl |
IEEE Trans. Signal Inf. Process. over Networks
|
| 2026 | J | jnl |
Comput. Secur.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IET Commun.
|
| 2025 | — | conf |
ICCBN
|
| 2025 | — | conf |
ICC
|
| 2025 | J | jnl |
Trans. Mach. Learn. Res.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | B | conf |
IWCMC
|
| 2025 | A* | conf |
AAAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
IJCAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | Misc | conf |
ICASSP
|
| 2025 | C | conf |
CloudCom
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
AAAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Inf. Fusion
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Wirel. Commun.
|
| 2024 | — | conf |
ECCV (72)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ICPR (5)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ICONS
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
PeerJ Comput. Sci.
|
| 2024 | A* | conf |
CVPR
|
| 2024 | J | jnl |
CoRR
|
| 2023 | — | conf |
ICA3PP (1)
|
| 2023 | J | jnl |
Appl. Intell.
|
| 2023 | J | jnl |
Sensors
|
| 2023 | B | conf |
IWCMC
|
| 2022 | J | jnl |
IEEE Open J. Circuits Syst.
|
| 2022 | J | jnl |
Appl. Intell.
|
| 2022 | A | conf |
ICME
|
| 2022 | A* | conf |
NeurIPS
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
EMBC
|
| 2017 | — | conf |
ICAIT
|
| 2016 | — | conf |
ICSAI
|