| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2025 | J | jnl |
4D Virtual Imaging Platform for Dynamic Joint Assessment via Uni-Plane X-ray and 2D-3D Registration.
CoRR
|
| 2025 | — | conf |
SIGSIM-PADS
|
| 2025 | B | conf |
ICPP
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Secur. Saf.
|
| 2025 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2025 | — | conf |
QRSEC@CCS
|
| 2025 | A* | conf |
ISCA
|
| 2024 | J | jnl |
IEICE Electron. Express
|
| 2024 | — | conf |
DSC
|
| 2024 | — | conf |
DSC
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2023 | — | conf |
OFC
|
| 2023 | J | jnl |
IEEE Consumer Electron. Mag.
|
| 2023 | — | conf |
DSC
|
| 2023 | — | conf |
DSC
|
| 2023 | Misc | conf |
ICASSP
|
| 2023 | J | jnl |
CoRR
|
| 2022 | — | conf |
WASA (1)
|
| 2021 | — | conf |
ICEA
|
| 2021 | — | conf |
DSC
|
| 2021 | — | conf |
SEPC: Improving Joint Extraction of Entities and Relations by Strengthening Entity Pairs Connection.
PAKDD (1)
|
| 2020 | A* | conf |
AAAI
|
| 2019 | — | conf |
ICCS (5)
|
| 2017 | C | conf |
ICMV
|
| 2016 | C | conf |
KSEM
|
| 2016 | — | conf |
CCKS
|