| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Dependable Secur. Comput.
|
| 2026 | J | jnl |
IEEE Trans. Software Eng.
|
| 2025 | J | jnl |
Int. J. Comput. Intell. Syst.
|
| 2025 | B | conf |
TrustCom
|
| 2025 | J | jnl |
J. Syst. Archit.
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
IEEE Trans. Dependable Secur. Comput.
|
| 2023 | J | jnl |
J. Circuits Syst. Comput.
|
| 2022 | — | conf |
SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta
|
| 2020 | C | conf |
IV
|
| 2019 | C | conf |
IV
|
| 2019 | C | conf |
IV
|
| 2019 | — | conf |
ITSC
|
| 2018 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2018 | B | conf |
Intelligent Vehicles Symposium
|
| 2018 | B | conf |
Intelligent Vehicles Symposium
|
| 2018 | — | conf |
ITSC
|
| 2018 | B | conf |
Intelligent Vehicles Symposium
|
| 2018 | J | jnl |
Ad Hoc Sens. Wirel. Networks
|
| 2017 | — | conf |
DASC/PiCom/DataCom/CyberSciTech
|
| 2017 | J | jnl |
IEEE Access
|
| 2017 | — | conf |
SmartWorld/SCALCOM/UIC/ATC/CBDCom/IOP/SCI
|
| 2017 | — | conf |
IOV
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2016 | — | conf |
LABELS/DLMIA@MICCAI
|
| 2009 | J | jnl |
Intell. Autom. Soft Comput.
|