| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Signal Process.
|
| 2025 | — | conf |
ICC
|
| 2025 | C | conf |
ISCAS
|
| 2025 | J | jnl |
IET Circuits Devices Syst.
|
| 2025 | J | jnl |
Gov. Inf. Q.
|
| 2025 | — | conf |
ICC Workshops
|
| 2025 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2025 | — | conf |
ASP-DAC
|
| 2024 | — | conf |
VTC Spring
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | — | conf |
VTC Spring
|
| 2024 | — | conf |
ICCT
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | — | conf |
ICC
|
| 2023 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2023 | B | conf |
GLOBECOM
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2023 | J | jnl |
Digit. Commun. Networks
|
| 2022 | J | jnl |
IEEE Commun. Lett.
|
| 2022 | J | jnl |
J. Real Time Image Process.
|
| 2022 | J | jnl |
IET Signal Process.
|
| 2022 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
IET Commun.
|
| 2021 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2021 | J | jnl |
IEEE Trans. Commun.
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2020 | — | conf |
HPCC/DSS/SmartCity
|
| 2020 | J | jnl |
IEICE Electron. Express
|
| 2020 | J | jnl |
Integr.
|
| 2019 | — | conf |
RCAR
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
ASICON
|
| 2019 | — | conf |
ICCT
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | B | conf |
GLOBECOM
|
| 2019 | J | jnl |
IEEE Trans. Signal Process.
|
| 2019 | J | jnl |
IEEE Internet Things J.
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2018 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2018 | B | conf |
GLOBECOM
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2018 | — | conf |
DSP
|
| 2018 | J | jnl |
Sci. China Inf. Sci.
|
| 2018 | — | conf |
ISTC
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2018 | J | jnl |
IEEE J. Solid State Circuits
|
| 2017 | — | conf |
WCSP
|
| 2017 | — | conf |
MWSCAS
|
| 2017 | — | conf |
MWSCAS
|
| 2017 | J | jnl |
IEEE J. Emerg. Sel. Topics Circuits Syst.
|
| 2017 | J | jnl |
IEICE Electron. Express
|
| 2016 | — | conf |
GLOBECOM Workshops
|
| 2016 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2016 | C | conf |
ISCAS
|
| 2016 | — | conf |
DSP
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | C | conf |
ISCAS
|
| 2016 | — | conf |
GLOBECOM Workshops
|
| 2016 | — | conf |
DSP
|
| 2016 | J | jnl |
Int. J. Embed. Syst.
|
| 2016 | J | jnl |
IEEE Signal Process. Lett.
|
| 2015 | — | conf |
ASICON
|
| 2015 | — | conf |
ASICON
|
| 2015 | — | conf |
ASICON
|
| 2015 | J | jnl |
IEICE Electron. Express
|
| 2015 | C | conf |
ISCAS
|
| 2015 | — | conf |
ASICON
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2015 | — | conf |
ASICON
|
| 2014 | — | conf |
ISIC
|
| 2014 | C | conf |
ISCAS
|
| 2014 | C | conf |
ISCAS
|
| 2014 | C | conf |
ISCAS
|
| 2014 | C | conf |
ISCAS
|
| 2014 | J | jnl |
IEEE Trans. Signal Process.
|
| 2014 | J | jnl |
Int. J. Wirel. Mob. Comput.
|
| 2013 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2013 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2013 | C | conf |
ISCAS
|
| 2013 | C | conf |
ISCAS
|
| 2013 | B | conf |
GLOBECOM
|
| 2013 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2013 | J | jnl |
IEEE Signal Process. Lett.
|
| 2013 | J | jnl |
Wirel. Pers. Commun.
|
| 2012 | J | jnl |
Comput. Electr. Eng.
|
| 2012 | J | jnl |
IEICE Electron. Express
|
| 2012 | J | jnl |
Microelectron. Reliab.
|
| 2012 | B | conf |
WCNC
|
| 2012 | C | conf |
ISCAS
|
| 2012 | J | jnl |
IEICE Electron. Express
|
| 2011 | J | jnl |
Wirel. Pers. Commun.
|
| 2011 | — | conf |
WOCC
|
| 2011 | — | conf |
CHINACOM
|
| 2011 | C | conf |
ISCAS
|
| 2010 | J | jnl |
Sci. China Inf. Sci.
|
| 2010 | — | conf |
Energy and delay-aware mapping for real-time digital processing system on network on chip platforms.
SoCC
|
| 2010 | — | conf |
WCNIS
|
| 2008 | J | jnl |
Sci. China Ser. F Inf. Sci.
|
| 2008 | — | conf |
APCCAS
|
| 2007 | B | conf |
WCNC
|
| 2007 | — | conf |
FGCN (2)
|