| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Computers
|
| 2025 | J | jnl |
Symmetry
|
| 2024 | — | conf |
ICVISP
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2022 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2021 | J | jnl |
Sci. China Inf. Sci.
|
| 2020 | J | jnl |
IEICE Electron. Express
|
| 2020 | J | jnl |
IEICE Electron. Express
|
| 2019 | — | conf |
ASICON
|
| 2016 | — | conf |
CISP-BMEI
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2015 | J | jnl |
J. Signal Process. Syst.
|
| 2014 | J | jnl |
Microelectron. J.
|
| 2011 | — | conf |
ISCID (1)
|