| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | A* | conf |
HPCA
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | — | conf |
SemanticBBV: A Semantic Signature for Cross-Program Knowledge Reuse in Microarchitecture Simulation.
ASP-DAC
|
| 2025 | J | jnl |
CoRR
|
| 2025 | B | conf |
ICPP
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | J | jnl |
SemanticBBV: A Semantic Signature for Cross-Program Knowledge Reuse in Microarchitecture Simulation.
CoRR
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2024 | A | conf |
ICS
|
| 2024 | B | conf |
SPAA
|
| 2024 | A | conf |
DATE
|
| 2024 | — | conf |
ISVLSI
|
| 2023 | A | conf |
ICCAD
|
| 2023 | — | conf |
MEMSYS
|
| 2023 | A | conf |
ICCAD
|
| 2023 | A | conf |
DATE
|
| 2022 | A | conf |
DATE
|
| 2022 | A | conf |
ICCAD
|
| 2022 | — | conf |
ISVLSI
|
| 2022 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | A | conf |
DATE
|
| 2022 | J | jnl |
Integr.
|
| 2022 | A* | conf |
DAC
|
| 2022 | — | conf |
ISVLSI
|
| 2022 | — | conf |
OFC
|
| 2021 | C | conf |
ISCAS
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | — | conf |
ICICDT
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | A | conf |
DATE
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2019 | — | conf |
PHOTONICS@SC
|
| 2019 | A | conf |
ICCAD
|
| 2018 | — | conf |
ISVLSI
|
| 2018 | J | jnl |
IEEE Trans. Multi Scale Comput. Syst.
|
| 2018 | A | conf |
ICCAD
|
| 2018 | C | conf |
ICCD
|
| 2018 | — | conf |
ASP-DAC
|
| 2018 | A | conf |
DATE
|
| 2018 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2018 | — | ed. |
NOCS
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | A | conf |
DATE
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | A* | conf |
HPCA
|
| 2017 | A* | conf |
DAC
|
| 2017 | — | conf |
Modular reinforcement learning for self-adaptive energy efficiency optimization in multicore system.
ASP-DAC
|
| 2017 | A | conf |
ICCAD
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | J | jnl |
Alleviate Chip Pin Constraint for Multicore Processor by On/Off-Chip Power Delivery System Codesign.
ACM J. Emerg. Technol. Comput. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | — | conf |
NOCS
|
| 2016 | — | conf |
AISTECS@HiPEAC
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | A | conf |
DATE
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2015 | — | conf |
MMM (1)
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | A | conf |
DATE
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | — | conf |
MCSoC
|
| 2014 | J | jnl |
IEEE Des. Test
|
| 2014 | — | conf |
ISVLSI
|
| 2014 | — | conf |
APCCAS
|
| 2014 | — | conf |
NOCS
|
| 2014 | A | conf |
DATE
|
| 2014 | J | jnl |
IEEE Trans. Computers
|
| 2014 | — | conf |
NOCS
|
| 2014 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2014 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2014 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2014 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | J | jnl |
Microprocess. Microsystems
|
| 2013 | A | conf |
DATE
|
| 2013 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2013 | J | jnl |
NII Shonan Meet. Rep.
|
| 2013 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2013 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2013 | C | conf |
ISCAS
|
| 2012 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2011 | — | conf |
ISVLSI
|
| 2011 | — | conf |
ISVLSI
|
| 2011 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2011 | — | conf |
ISVLSI
|
| 2011 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2011 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2011 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2011 | C | conf |
ISCAS
|
| 2010 | — | conf |
ISVLSI
|
| 2010 | A | conf |
ICME
|
| 2010 | J | jnl |
Telecommun. Syst.
|
| 2010 | A* | conf |
DAC
|
| 2010 | — | conf |
NANOARCH
|
| 2009 | — | conf |
3DIC
|
| 2009 | — | conf |
ISVLSI
|
| 2009 | C | conf |
ISCAS
|
| 2009 | Misc | conf |
CASES
|
| 2009 | A | conf |
DATE
|
| 2009 | Misc | conf |
CODES+ISSS
|
| 2009 | J | jnl |
IEEE Micro
|
| 2009 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2009 | J | jnl |
Microprocess. Microsystems
|
| 2009 | — | conf |
ISVLSI
|
| 2008 | — | conf |
APCCAS
|
| 2008 | Misc | conf |
CODES+ISSS
|
| 2006 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2005 | J | jnl |
IEEE Des. Test Comput.
|
| 2005 | — | conf |
ISCAS (2)
|
| 2005 | A | conf |
ICME
|
| 2004 | A | conf |
DATE
|
| 2003 | — | conf |
Hot Interconnects
|
| 2003 | J | jnl |
J. Circuits Syst. Comput.
|
| 2002 | Misc | conf |
CASES
|