| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
Int. J. Multim. Inf. Retr.
|
| 2025 | J | jnl |
Vis. Comput.
|
| 2025 | Misc | conf |
ICASSP
|
| 2024 | J | jnl |
Sensors
|
| 2024 | A | conf |
SDM
|
| 2024 | — | conf |
PRCV (15)
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Int. J. Multim. Inf. Retr.
|
| 2023 | — | conf |
ICANN (7)
|
| 2023 | — | conf |
ACL (1)
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
KSEM (2)
|
| 2023 | — | conf |
KSEM (3)
|
| 2022 | J | jnl |
Inf. Manag.
|
| 2022 | — | conf |
CCIS
|
| 2021 | J | jnl |
J. Softw.
|
| 2021 | J | jnl |
Knowl. Based Syst.
|
| 2021 | B | conf |
ICIP
|
| 2020 | J | jnl |
Remote. Sens.
|
| 2020 | J | jnl |
IEEE Commun. Lett.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | B | conf |
ICIP
|
| 2020 | J | jnl |
Remote. Sens.
|
| 2020 | J | jnl |
Appl. Soft Comput.
|
| 2019 | J | jnl |
Soft Comput.
|
| 2019 | C | conf |
PCS
|
| 2019 | B | conf |
ICIP
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Complex.
|
| 2018 | — | conf |
BMSB
|
| 2018 | — | conf |
SmartGridComm
|
| 2015 | Misc | conf |
ICMLC
|
| 2015 | — | conf |
Hot Chips Symposium
|
| 2015 | — | conf |
VLSIC
|
| 2014 | J | jnl |
Digit. Signal Process.
|
| 2013 | B | conf |
ICIP
|
| 2012 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2011 | A | conf |
ICME
|
| 2011 | A | conf |
ICME
|
| 2011 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2011 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2011 | J | jnl |
IEICE Trans. Electron.
|
| 2011 | — | conf |
MMM (1)
|
| 2011 | — | conf |
ISPACS
|
| 2010 | — | conf |
ICCSA Workshops
|
| 2006 | — | conf |
ICIC (1)
|