Ji Chel Bea - RankMe

11 papers Journal 2Unranked 9

Year	Rank	Type	Title / Venue / Authors
2019	—	`conf`	Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. 3DIC Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima
2018	—	`conf`	Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal. IRPS Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi
2016	J	`jnl`	Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2015	—	`conf`	Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. 3DIC K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka
2015	—	`conf`	Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM. IRPS Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2015	—	`conf`	Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka
2014	—	`conf`	Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi
2014	—	`conf`	Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka
2011	J	`jnl`	Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2009	—	`conf`	Heterogeneous integration technology for MEMS-LSI multi-chip module. 3DIC Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2009	—	`conf`	Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi