| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | — | conf |
EUVIP
|
| 2025 | C | conf |
MMSP
|
| 2023 | J | jnl |
ACM Trans. Multim. Comput. Commun. Appl.
|
| 2023 | J | jnl |
IEEE Trans. Multim.
|
| 2023 | B | conf |
ICIP
|
| 2022 | J | jnl |
Signal Process. Image Commun.
|
| 2022 | C | conf |
MMSP
|
| 2022 | — | conf |
IPTA
|
| 2022 | J | jnl |
IEEE Access
|
| 2021 | B | conf |
ICIP
|
| 2019 | Misc | conf |
ICASSP
|
| 2019 | J | jnl |
IEEE Trans. Multim.
|
| 2018 | — | conf |
ICME Workshops
|
| 2017 | C | conf |
MMSP
|
| 2016 | — | conf |
3D Image Processing, Measurement (3DIPM), and Applications
|
| 2015 | J | jnl |
Comput. Aided Des.
|
| 2015 | B | conf |
ICIP
|
| 2015 | — | conf |
Three-Dimensional Image Processing, Measurement (3DIPM), and Applications
|
| 2013 | C | conf |
MMSP
|
| 2012 | — | conf |
Three-Dimensional Image Processing (3DIP) and Applications
|
| 2011 | — | conf |
MIAD
|
| 2011 | — | conf |
Three-Dimensional Imaging, Interaction, and Measurement
|
| 2010 | J | jnl |
Signal Process. Image Commun.
|
| 2010 | — | conf |
Three-Dimensional Image Processing (3DIP) and Applications
|
| 2008 | — | conf |
EUSIPCO
|
| 2007 | — | conf |
EUSIPCO
|