| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
Comput. Electr. Eng.
|
| 2025 | J | jnl |
Multim. Tools Appl.
|
| 2025 | J | jnl |
Oper. Res. Forum
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
J. Comput. Virol. Hacking Tech.
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2023 | C | conf |
TENCON
|
| 2023 | J | jnl |
Int. J. Intell. Syst.
|
| 2023 | J | jnl |
Wirel. Pers. Commun.
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | — | conf |
CVIP (2)
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2022 | J | jnl |
Int. J. Ultra Wideband Commun. Syst.
|
| 2022 | J | jnl |
J. Real Time Image Process.
|
| 2021 | — | conf |
CVIP (2)
|
| 2018 | — | conf |
RAIT
|
| 2018 | — | conf |
ICIIS
|
| 2018 | J | jnl |
IET Commun.
|