| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2014 | J | jnl |
IEEE J. Solid State Circuits
|
| 2014 | — | conf |
Image-Guided Procedures
|
| 2014 | — | conf |
IMSE
|
| 2014 | — | conf |
MOBMU
|
| 2013 | — | conf |
Image-Guided Procedures
|
| 2013 | — | conf |
Sensors, Cameras, and Systems for Industrial and Scientific Applications
|
| 2013 | J | jnl |
Signal Process. Image Commun.
|
| 2013 | — | conf |
Three-Dimensional Image Processing (3DIP) and Applications
|
| 2013 | — | conf |
Image-Guided Procedures
|
| 2013 | — | conf |
CCNC
|
| 2013 | B | conf |
Image Processing
|
| 2013 | — | conf |
Computer-Aided Diagnosis
|
| 2013 | — | conf |
Image-Guided Procedures
|
| 2013 | C | conf |
ICCE
|
| 2013 | — | conf |
Image-Guided Procedures
|
| 2012 | — | conf |
ISSCC
|
| 2012 | J | jnl |
IEEE J. Solid State Circuits
|
| 2012 | — | conf |
Three-Dimensional Image Processing (3DIP) and Applications
|
| 2012 | — | conf |
UIST (Adjunct Volume)
|
| 2012 | C | conf |
High-precision 6-DOF motion tracking architecture with compact low-cost sensors for 3D manipulation.
ICCE
|
| 2012 | — | conf |
ERVR
|
| 2012 | — | conf |
Sensors, Cameras, and Systems for Industrial and Scientific Applications
|
| 2012 | — | conf |
Three-Dimensional Image Processing (3DIP) and Applications
|
| 2012 | — | conf |
Computational Imaging
|
| 2011 | B | conf |
ICIP
|
| 2011 | B | conf |
ICIP
|
| 2011 | — | conf |
Three-Dimensional Imaging, Interaction, and Measurement
|
| 2011 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2011 | B | conf |
ICIP
|
| 2010 | C | conf |
MMSP
|
| 2010 | B | conf |
ICIP
|
| 2010 | B | conf |
ICIP
|
| 2004 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2002 | — | conf |
ICIP (3)
|
| 2000 | A | conf |
IEEE International Conference on Multimedia and Expo (II)
|