Jaemin Lim - RankMe

12 papers A* 2A 1Misc 2Journal 3Unranked 4

Year	Rank	Type	Title / Venue / Authors
2025	A	`conf`	Parameter-efficient Fine-tuning of Conformer-based Streaming Speech Recognition into Non-streaming Models. INTERSPEECH Yunjae Nam, Jeong U. Han, Kiyeon Kim, Jaemin Lim
2025	J	`jnl`	Post-evaluation Model Using Fuzzy Theory. Int. J. Fuzzy Log. Intell. Syst. Suyoung Yang, Jaemin Lim, Eunhyo Lee, Yeonkyung Lee, Jin Hee Yoon, Dae Jong Kim
2024	Misc	`conf`	Wav2vec-VC: Voice Conversion via Hidden Representations of Wav2vec 2.0. ICASSP Jaemin Lim, Kiyeon Kim
2022	A*	`conf`	Overo: Sharing Private Audio Recordings. CCS Jaemin Lim, Kiyeon Kim, Hyunwoo Yu, Suk-Bok Lee
2020	J	`jnl`	Making Connected Cars Untraceable via DSRC Radios. IEEE Access Jaemin Lim, Kiyeon Kim, Hyunwoo Yu, Suk-Bok Lee
2018	A*	`conf`	Pinto: Enabling Video Privacy for Commodity IoT Cameras. CCS Hyunwoo Yu, Jaemin Lim, Kiyeon Kim, Suk-Bok Lee
2017	J	`jnl`	Preserving Location Privacy of Connected Vehicles With Highly Accurate Location Updates. IEEE Commun. Lett. Jaemin Lim, Hyunwoo Yu, Kiyeon Kim, Minho Kim, Suk-Bok Lee
2017	Misc	`conf`	ViewMap: Sharing Private In-Vehicle Dashcam Videos. NSDI Minho Kim, Jaemin Lim, Hyunwoo Yu, Kiyeon Kim, Younghoon Kim, Suk-Bok Lee
2015	—	`conf`	Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim
2015	—	`conf`	Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. 3DIC Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim
2015	—	`conf`	Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim
2015	—	`conf`	TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim

Kai Greshake, Sahar Abdelnabi, Shailesh Mishra, Christoph Endres, Thorsten Holz, Mario Fritz