Jacob R. Minz

13 papers A* 1A 3Journal 4Unranked 4
YearRankTypeTitle / Venue / Authors
2008 — conf
Buffered clock tree synthesis for 3D ICs under thermal variations.
ASP-DAC
Jacob R. Minz, Xin Zhao, Sung Kyu Lim
2007 J jnl
Decoupling-Capacitor Planning and Sizing for Noise and Leakage Reduction.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Eric Wong, Jacob R. Minz, Sung Kyu Lim
2006 J jnl
Block-level 3-D Global Routing With an Application to 3-D Packaging.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Jacob R. Minz, Sung Kyu Lim
2006 A conf
Decoupling capacitor planning and sizing for noise and leakage reduction.
ICCAD
Eric Wong, Jacob R. Minz, Sung Kyu Lim
2006 J jnl
Multi-Objective Module Placement For 3-D System-On-Package.
IEEE Trans. Very Large Scale Integr. Syst.
Eric Wong, Jacob R. Minz, Sung Kyu Lim
2006 A conf
Optical routing for 3D system-on-package.
DATE
Jacob R. Minz, Somaskanda Thyagaraja, Sung Kyu Lim
2006 — —
Physical Design Automation for System-on-Packages and 3D-Integrated Circuits.
Jacob R. Minz
2006 J jnl
Profile-guided microarchitectural floor planning for deep submicron processor design.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watewai, Hsien-Hsin S. Lee, Sung Kyu Lim
2005 — conf
3D module placement for congestion and power noise reduction.
ACM Great Lakes Symposium on VLSI
Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh
2005 — conf
Reliability-aware floorplanning for 3D circuits.
SoCC
Jacob R. Minz, Eric Wong, Sung Kyu Lim
2004 — conf
Layer assignment for reliable system-on-package.
ASP-DAC
Jacob R. Minz, Sung Kyu Lim
2004 A conf
Net and Pin Distribution for 3D Package Global Routing.
DATE
Jacob R. Minz, Mohit Pathak, Sung Kyu Lim
2004 A* conf
Profile-guided microarchitectural floorplanning for deep submicron processor design.
DAC
Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watewai, Hsien-Hsin S. Lee, Sung Kyu Lim