Ivan Ciofi

23 papers Journal 3Unranked 19
YearRankTypeTitle / Venue / Authors
2025 — conf
Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps.
IRPS
Alicja Lesniewska, Y. Fang, G. Delie, Philippe Roussel, Koen Van Sever, Emmanuel Chery, O. Varela Pedreira, Ivan Ciofi, S. H. Park, Zsolt Tokei, Kris Croes
2025 — conf
Local Electric Field-Aware 3D TDDB Model for BEOL Reliability Predictions.
IRPS
Y. Fang, Alicja Lesniewska, Ivan Ciofi, Philippe Roussel, I. De Wolf, Kris Croes
2024 — conf
BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure.
IRPS
Yu Fang, Alicja Lesniewska, Ivan Ciofi, Philippe Roussel, Chen Wu, Victor Vega-Gonzalez, Ingrid De Wolf, Kris Croes
2024 — conf
De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure.
IRPS
O. Varela Pedreira, Youqi Ding, D. Coenen, Philippe Roussel, Ahmed Sobhi Saleh, Veerle Simons, Houman Zahedmanesh, Ivan Ciofi, Kris Croes
2024 — conf
Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND.
IRPS
Davide Tierno, Antonio Arreghini, Alicja Lesniewska, Y. Jeong, Marleen H. van der Veen, J. Stiers, N. Bazzazian, Ivan Ciofi, Geert Van den Bosch, Maarten Rosmeulen
2024 — conf
Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects.
VLSI Technology and Circuits
Anshul Gupta, Shreya Kundu, Stefan Decoster, K. Sah, G. Delie, B. Truijen, Davide Tierno, Giulio Marti, O. Varela Pedreira, B. Kenens, Y. Hermans, C. Adelmann, B. de Wachter, Ivan Ciofi, G. Murdoch, A. Cross, Seongho Park, Zsolt Tokei
2023 — conf
A pragmatic network-aware paradigm for system-level electromigration predictions at scale.
IRPS
Houman Zahedmanesh, Philippe Roussel, Ivan Ciofi, Kristof Croes
2023 — conf
Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node.
VLSI Technology and Circuits
Giuliano Sisto, R. Preston, Rongmei Chen, Gioele Mirabelli, Anita Farokhnejad, Yun Zhou, Ivan Ciofi, Anne Jourdain, A. Veloso, Michele Stucchi, Odysseas Zografos, Pieter Weckx, Geert Hellings, Julien Ryckaert
2023 — conf
Challenges for Interconnect Reliability: From Element to System Level.
ISPD
Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes
2023 — conf
Towards accurate temperature prediction in BEOL for reliability assessment (Invited).
IRPS
Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
2022 — conf
Assessment of critical Co electromigration parameters.
IRPS
O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes
2022 — conf
System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents.
IRPS
Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Kristof Croes, Mustafa Badaroglu
2021 — conf
A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network.
SLIP
Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes
2018 — conf
Insights into metal drift induced failure in MOL and BEOL.
IRPS
Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tökei, Kris Croes
2018 — conf
Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.
IRPS
Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf
2017 J jnl
LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration.
Microelectron. Reliab.
Deniz Kocaay, Philippe Roussel, Kris Croes, Ivan Ciofi, Yves Saad, Ingrid De Wolf
2016 J jnl
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.
Microelectron. Reliab.
Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei
2015 — conf
Impact of process variability on BEOL TDDB lifetime model assessment.
IRPS
Kris Croes, Deniz Kocaay, Ivan Ciofi, Jürgen Bömmels, Zsolt Tökei
2015 — conf
Intrinsic reliability of local interconnects for N7 and beyond.
IRPS
Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tökei, Jürgen Bömmels, Yves Saad, W. Gao
2014 — conf
Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies.
ESSDERC
Trong Huynh Bao, Dmitry Yakimets, Julien Ryckaert, Ivan Ciofi, Rogier Baert, Anabela Veloso, Jürgen Bömmels, Nadine Collaert, Philippe Roussel, S. Demuynck, Praveen Raghavan, Abdelkarim Mercha, Zsolt Tokei, Diederik Verkest, Aaron Thean, Piet Wambacq
2012 — conf
Methodology for extracting the characteristic capacitances of a power MOSFET transistor, using conventional on-wafer testing techniques.
ESSDERC
Christoph Kerner, Ivan Ciofi, Thomas Chiarella, Stefaan Van Huylenbroeck
2001 — —
Metodi e strumentazione per la caratterizzazione di interconnessioni VLSI.
Ivan Ciofi
2000 J jnl
Temperature controlled oven for low noise measurement systems [for electromigration characterization].
IEEE Trans. Instrum. Meas.
Carmine Ciofi, Ivan Ciofi, Stefano C. Di Pascoli, Bruno Neri