Ingrid De Wolf

74 papers C 1Misc 1Journal 41Unranked 31

Year	Rank	Type	Title / Venue / Authors
2025	J	`jnl`	Intermetallic Compounds (IMCs) Growth Investigation, Kinetic Parameter Analysis and Reliability Evaluation of In Solder Metal for 3D Integration Packaging. IEEE J. Emerg. Sel. Topics Circuits Syst. Tassawar Hussain, Jaber Derakhshandeh, Tom Cochet, Ehsan Shafahian, Prathamesh Dhakras, Aksel Göhnermeier, Eric Beyne, Ingrid De Wolf
2025	—	`conf`	Lifetime Model for Enabling Reliable InGaAs/GaAs Nano-Ridge Lasers Monolithically Integrated on 300 mm Silicon. OFC Ping-Yi Hsieh, Artemisia Tsiara, Barry J. O'Sullivan, Sara El Akel, Huseyin Sar, Debi Prasad Panda, Peter Swekis, Didit Yudistira, Bernardette Kunert, Joris Van Campenhout, Ingrid De Wolf
2025	J	`jnl`	Novel Concept-Oriented Synthetic Data approach for Training Generative AI-Driven Crystal Grain Analysis Using Diffusion Model. CoRR Ahmed Sobhi Saleh, Kristof Croes, Hajdin Ceric, Ingrid De Wolf, Houman Zahedmanesh
2024	—	`conf`	BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure. IRPS Yu Fang, Alicja Lesniewska, Ivan Ciofi, Philippe Roussel, Chen Wu, Victor Vega-Gonzalez, Ingrid De Wolf, Kris Croes
2024	—	`conf`	Fundamental understanding of NBTI degradation mechanism in IGZO channel devices. IRPS Ying Zhao, Pietro Rinaudo, Adrian Vaisman Chasin, Brecht Truijen, Ben Kaczer, Nouredine Rassoul, Harold Dekkers, Attilio Belmonte, Ingrid De Wolf, Gouri Sankar Kar, Jacopo Franco
2024	—	`conf`	Light-Assisted Investigation of the Role of Oxygen Flow during IGZO Deposition on Deep Subgap States and their Evolution Under PBTI. IRPS Pietro Rinaudo, Adrian Vaisman Chasin, Ying Zhao, Ben Kaczer, Nouredine Rassoul, Harold Dekkers, Michiel J. van Setten, Attilio Belmonte, Ingrid De Wolf, Gouri Sankar Kar, Jacopo Franco
2024	—	`conf`	Modeling Dark Current Degradation of Monolithic InGaAs/GaAs-On-Si Nano-Ridge Photodetectors. IRPS Ping-Yi Hsieh, Ameni Ben Driss, Artemisia Tsiara, Barry J. O'Sullivan, Didit Yudistira, Bernardette Kunert, Joris Van Campenhout, Ingrid De Wolf
2024	—	`conf`	SILC and TDDB reliability of novel low thermal budget RMG gate stacks. IRPS Andrea Vici, Robin Degraeve, Naoto Horiguchi, Ingrid De Wolf, Jacopo Franco
2023	—	`conf`	Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations. IRPS Andrea Vici, Robin Degraeve, Philippe J. Roussel, Jacopo Franco, Ben Kaczer, Ingrid De Wolf
2023	J	`jnl`	Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. David Coenen, Herman Oprins, Robin Degraeve, Ingrid De Wolf
2023	Misc	`conf`	Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator. PSC David Coenen, Minkyu Kim, Herman Oprins, Ingrid De Wolf, Yoojin Ban, Joris Van Campenhout
2023	—	`conf`	Impact of via geometry and line extension on via-electromigration in nano-interconnects. IRPS Ahmed Sobhi Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes
2023	—	`conf`	Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes
2022	—	`conf`	Combining SILC and BD statistics for low-voltage lifetime projection in HK/MG stacks. IRPS Andrea Vici, Robin Degraeve, João Pedro Bastos, Philippe Roussel, Ingrid De Wolf
2022	—	`conf`	Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress. IRPS Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf
2022	—	`conf`	Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon. IRPS Ping-Yi Hsieh, Artemisia Tsiara, Barry J. O'Sullivan, Didit Yudistira, Marina Baryshnikova, Guido Groeseneken, Bernardette Kunert, Marianna Pantouvaki, Joris Van Campenhout, Ingrid De Wolf
2021	—	`conf`	Impact of mechanical strain on wakeup of HfO2 ferroelectric memory. IRPS Anastasiia Kruv, Sean R. C. McMitchell, Sergiu Clima, Oguzhan O. Okudur, Nicolo Ronchi, Geert Van den Bosch, Mario Gonzalez, Ingrid De Wolf, Jan Van Houdt
2021	—	`conf`	Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR). CASE Michael Kögel, Sebastian Brand, Christian Große, Kristof J. P. Jacobs, Ingrid De Wolf, Frank Altmann
2020	—	`conf`	On the impact of mechanical stress on gate oxide trapping. IRPS Anastasiia Kruv, Ben Kaczer, Alexander Grill, Mario Gonzalez, Jacopo Franco, Dimitri Linten, Wolfgang Goes, Tibor Grasser, Ingrid De Wolf
2019	—	`conf`	Impact of Mechanical Stress on the Electrical Performance of 3D NAND. IRPS Anastasiia Kruv, Antonio Arreghini, Mario Gonzalez, Devin Verreck, Geert Van den Bosch, Ingrid De Wolf, Arnaud Furnémont
2019	—	`conf`	Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. IRPS Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes
2019	—	`conf`	New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis. IRPS Norbert Herfurth, Anne Beyreuther, Elham Amini, Christian Boit, Michél Simon-Najasek, Susanne Hübner, Frank Altmann, R. Herfurth, Chen Wu, Ingrid De Wolf, Kris Croes
2019	—	`conf`	Study of the Mechanical Stress Impact on Silicide Contact Resistance by 4-Point Bending. IRPS Yefan Liu, Hao Yu, Gaspard Hiblot, Anastasiia Kruv, Marc Schaekers, Naoto Horiguchi, Dimitrios Velenis, Ingrid De Wolf
2018	J	`jnl`	Detection of failure mechanisms in 24-40 nm FinFETs with (spectral) photon emission techniques using InGaAs camera. Microelectron. Reliab. Ivo Vogt, Tomonori Nakamura, Ingrid De Wolf, Christian Boit
2018	—	`conf`	Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing. IRPS Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf
2018	J	`jnl`	Photon emission as a characterization tool for bipolar parasitics in FinFET technology. Microelectron. Reliab. Anne Beyreuther, Norbert Herfurth, Elham Amini, Tomonori Nakamura, Ingrid De Wolf, Christian Boit
2018	—	`conf`	Stress mitigation of 3D-stacking/packaging induced stresses. IRPS Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne
2018	—	`conf`	The first observation of p-type electromigration failure in full ruthenium interconnects. IRPS Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes
2017	J	`jnl`	Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei
2017	J	`jnl`	LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration. Microelectron. Reliab. Deniz Kocaay, Philippe Roussel, Kris Croes, Ivan Ciofi, Yves Saad, Ingrid De Wolf
2017	J	`jnl`	Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices. Microelectron. Reliab. Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne
2017	J	`jnl`	Study of GHz-SAM sensitivity to delamination in BEOL layers. Microelectron. Reliab. Ahmad Khaled, Luka Kljucar, Sebastian Brand, Michael Kögel, Robert Aertgeerts, Ruben Nicasy, Ingrid De Wolf
2016	—	`conf`	50Gb/s C-band GeSi waveguide electro-absorption modulator. OFC S. A. Srinivasan, Peter Verheyen, R. Loo, Ingrid De Wolf, Marianna Pantouvaki, Guy Lepage, S. Balakrishnan, W. Vanherle, Philippe Absil, Joris Van Campenhout
2016	J	`jnl`	B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages. Microelectron. Reliab. Aidan Cowley, Andrej Ivankovic, C. S. Wong, N. S. Bennett, A. N. Danilewsky, Marcel Gonzalez, Vladimir Cherman, Bart Vandevelde, Ingrid De Wolf, Patrick J. McNally
2016	J	`jnl`	Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy. Microelectron. Reliab. Martin Herms, Matthias Wagner, Ingrid De Wolf
2016	J	`jnl`	Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. Microelectron. Reliab. Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei
2016	J	`jnl`	Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis. Microelectron. Reliab. Ahmad Khaled, Sebastian Brand, Michael Kögel, Tim Appenroth, Ingrid De Wolf
2016	—	`conf`	New fast distributed thermal model for analysis of GaN based power devices. ESSDERC Vice Sodan, Federica Lidia Teresa Maggioni, Herman Oprins, Steve Stoffels, Martine Baelmans, Ingrid De Wolf
2016	J	`jnl`	Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne
2015	—	`conf`	Constant voltage electromigration for advanced BEOL copper interconnects. IRPS Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen
2015	—	`conf`	Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes
2015	J	`jnl`	Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. Microelectron. Reliab. Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf
2015	—	`conf`	Through silicon via to FinFET noise coupling in 3-D integrated circuits. ICICDT A. Rouhi Najaf Abadi, W. Guo, X. Sun, K. Ben Ali, Jean-Pierre Raskin, Martin Rack, C. Roda Neve, M. Choi, V. Moroz, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Philippe P. Absil
2014	J	`jnl`	As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability. Microelectron. Reliab. Baojun Tang, Kris Croes, Yohan Barbarin, Yunqi Wang, Robin Degraeve, Yunlong Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf
2014	J	`jnl`	Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei
2014	J	`jnl`	Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact. Microelectron. J. F. L. T. Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans
2014	J	`jnl`	Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectron. Reliab. Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes
2014	J	`jnl`	Sn whisker evaluations in 3D microbumped structures. Microelectron. Reliab. George Vakanas, Björn Vandecasteele, David Schaubroeck, Joke De Messemaeker, Geert Willems, Mark Ashworth, Geoffrey D. Wilcox, Ingrid De Wolf
2013	J	`jnl`	A novel method to measure the internal pressure of MEMS thin-film packages. Microelectron. Reliab. B. Wang, Jeroen De Coster, Martine Wevers, Ingrid De Wolf
2012	—	`conf`	3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
2012	J	`jnl`	Diffusion growth of Cu Microelectron. Reliab. Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf
2012	J	`jnl`	Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing. Microelectron. Reliab. Ahmad Khaled, Moatassim Raoof, Vladimir Cherman, Karoline Jans, Mohammad Abbas, Shaker Ebrahim, Goerge Bryce, Peter Verheyen, Ann Witvrouw, Ingrid De Wolf
2012	J	`jnl`	MEMS packaging and reliability: An undividable couple. Microelectron. Reliab. Harrie A. C. Tilmans, Jeroen De Coster, Philippe Hélin, Vladimir Cherman, Anne Jourdain, Piet De Moor, Bart Vandevelde, Nga P. Pham, Joseph Zekry, Ann Witvrouw, Ingrid De Wolf
2012	J	`jnl`	Study of glass frit induced stiction using a micromirror array. Microelectron. Reliab. Fangzhou Ling, Jeroen De Coster, Ann Witvrouw, Jean-Pierre Celis, Ingrid De Wolf
2011	—	`conf`	Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte
2011	J	`jnl`	Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectron. Reliab. Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne
2011	J	`jnl`	Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
2011	J	`jnl`	Electrical characterization and reliability study of integrated GaN power amplifier in multi-layer thin-film technology. Microelectron. Reliab. Rui Liu, Dominique M. M.-P. Schreurs, Walter De Raedt, Frederik Vanaverbeke, J. Das, Robert Mertens, Ingrid De Wolf
2011	—	`conf`	In-line metrology and inspection for process control during 3D stacking of IC's. 3DIC Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne
2011	J	`jnl`	Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach. Microelectron. Reliab. Melina Lofrano, Kris Croes, Ingrid De Wolf, Christopher J. Wilson
2011	J	`jnl`	Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS. Microelectron. Reliab. Bo Wang, Shuji Tanaka, B. Guo, G. Vereecke, Simone Severi, Ann Witvrouw, Martine Wevers, Ingrid De Wolf
2011	J	`jnl`	Thermal optimization of GaN-on-Si HEMTs with plastic package. Microelectron. Reliab. Rui Liu, Dominique M. M.-P. Schreurs, Walter De Raedt, Frederik Vanaverbeke, Robert Mertens, Ingrid De Wolf
2010	C	`conf`	3D integration: Circuit design, test, and reliability challenges. IOLTS Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal
2010	—	`conf`	Design issues and considerations for low-cost 3D TSV IC technology. ISSCC Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne
2010	J	`jnl`	Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors. Microelectron. Reliab. Sandeep Sangameswaran, Jeroen De Coster, Guido Groeseneken, Ingrid De Wolf
2010	J	`jnl`	Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. Microelectron. Reliab. Y. Yang, Riet Labie, F. Ling, C. Zhao, A. Radisic, Jan Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf
2008	J	`jnl`	Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency. Microelectron. Reliab. Stanislaw Kalicinski, Martine Wevers, Ingrid De Wolf
2008	J	`jnl`	Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures. Microelectron. Reliab. Yu Yang, Hugo Bender, Kai Arstila, Bart Swinnen, Bert Verlinden, Ingrid De Wolf
2008	J	`jnl`	Editorial. Microelectron. Reliab. Guido Groeseneken, Ingrid De Wolf, A. J. Mouthaan, Jaap Bisschop
2004	J	`jnl`	Creep as a reliability problem in MEMS. Microelectron. Reliab. Robert Modlinski, Ann Witvrouw, Petar Ratchev, Anne Jourdain, Veerle Simons, H. A. C. Tilmans, Jaap M. J. den Toonder, Robert Puers, Ingrid De Wolf
2003	J	`jnl`	MEMS reliability. Microelectron. Reliab. Ingrid De Wolf
2002	J	`jnl`	Techniques to study the reliability of metal RF MEMS capacitive switches. Microelectron. Reliab. Ingrid De Wolf, W. Merlijn van Spengen
2001	J	`jnl`	Investigation of stress in shallow trench isolation using UV micro-Raman spectroscopy. Microelectron. Reliab. Kai F. Dombrowski, B. Dietrich, Ingrid De Wolf, R. Rooyackers, G. Badenes
2001	J	`jnl`	Spectroscopic photon emission microscopy: a unique tool for failure analysis of microelectronics devices. Microelectron. Reliab. Ingrid De Wolf, Mahmoud Rasras