Hélène Frémont

43 papers Journal 37Unranked 6
YearRankTypeTitle / Venue / Authors
2025 — conf
Investigation Into the Moisture Degradation Mechanism of Integrated Stacks Using New Moisture Sensor Design.
IRPS
B. Ayoub, G. Imbert, F. Belfis, T. Parrassin, Sébastien Gallois-Garreignot, L. Mischler, Geneviève Duchamp, Hélène Frémont
2023 — conf
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.
IRPS
Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne
2022 — conf
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects.
IRPS
Bassel Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Hélène Frémont
2020 — conf
Readout Circuit Implemented on PCB-Level for Embedded CNT Sensors.
I2MTC
Quentin Vandier, Julien Pezard, Hélène Frémont, Éric Duchesne, Dominique Drouin
2019 J jnl
Source Separation Using Sensor's Frequency Response: Theory and Practice on Carbon Nanotubes Sensors.
Sensors
Aurore Quelennec, Éric Duchesne, Hélène Frémont, Dominique Drouin
2018 J jnl
Creep measurement and choice of creep laws for BGA assemblies' reliability simulation.
Microelectron. Reliab.
S. Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont
2018 J jnl
Sequential combined thermal cycling and vibration test and simulation of printed circuit board.
Microelectron. Reliab.
Faical Arabi, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont
2017 J jnl
Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations.
Microelectron. Reliab.
S. Pin, Hélène Frémont, Alexandrine Guédon-Gracia
2017 J jnl
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach.
Microelectron. Reliab.
S. Hairoud-Airieau, Geneviève Duchamp, Tristan Dubois, Jean-Yves Delétage, André Durier, Hélène Frémont
2017 J jnl
High temperature ageing of microelectronics assemblies with SAC solder joints.
Microelectron. Reliab.
Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel
2017 J jnl
Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis.
Microelectron. Reliab.
Nathalie Labat, François Marc, Hélène Frémont, Marise Bafleur
2016 J jnl
Effects of salt spray test on lead-free solder alloy.
Microelectron. Reliab.
Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage
2015 J jnl
A methodologic project to characterize and model COTS component reliability.
Microelectron. Reliab.
André Durier, Alain Bensoussan, Moustafa Zerarka, Chaimae Ghfiri, Alexandre Boyer, Hélène Frémont
2015 J jnl
Characterization and model of temperature effect on the conducted immunity of Op-Amp.
Microelectron. Reliab.
Tristan Dubois, Siham Hairoud, Marcio Hermany Gomes de Oliveira, Hélène Frémont, Geneviève Duchamp
2015 J jnl
Dynamical IMC-growth calculation.
Microelectron. Reliab.
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
2015 J jnl
Editorial.
Microelectron. Reliab.
Marise Bafleur, Philippe Perdu, François Marc, Hélène Frémont, Nicolas Nolhier
2015 J jnl
Electro- and thermomigration induced Cu
Microelectron. Reliab.
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano
2015 J jnl
Virtual prototyping in a Design-for-Reliability approach.
Microelectron. Reliab.
Samed Barnat, Alexandrine Guédon-Gracia, Hélène Frémont
2014 J jnl
Qualification procedure for moisture in embedded capacitors.
Microelectron. Reliab.
Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp
2013 J jnl
Conductive adhesive joint for extreme temperature applications.
Microelectron. Reliab.
J. B. Jullien, Hélène Frémont, Jean-Yves Delétage
2013 J jnl
Electro- and thermomigration-induced IMC formation in SnAg
Microelectron. Reliab.
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano
2013 J jnl
Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques.
Microelectron. Reliab.
W. Ben Naceur, Nathalie Malbert, Nathalie Labat, Hélène Frémont, D. Carisetti, J. C. Clement, J. L. Muraro, Barbara Bonnet
2012 J jnl
A methodological approach for predictive reliability: Practical case studies.
Microelectron. Reliab.
Hélène Frémont, Geneviève Duchamp, Alexandrine Guédon-Gracia, Frédéric Verdier
2012 J jnl
Electro- and thermo-migration induced failure mechanisms in Package on Package.
Microelectron. Reliab.
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
2012 J jnl
Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength.
Microelectron. Reliab.
Samed Barnat, Hélène Frémont, Alexandrine Guédon-Gracia, Eric Cadalen
2012 — conf
International dimension to increase Lifelong Learning possibilities in Europe.
ITHET
Jean-Marc Thiriet, Hamed Yahoui, Hélène Frémont
2012 J jnl
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers.
Microelectron. Reliab.
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage
2012 — conf
PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning.
ITHET
Olivier Bonnaud, Hélène Frémont, Jean-Marc Thiriet, Hamed Yahoui
2012 J jnl
Pushing toward the limits of acceleration: Example on wire-bond assemblies.
Microelectron. Reliab.
Jean-Baptiste Jullien, Bernard Plano, Hélène Frémont
2011 J jnl
Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow.
Microelectron. Reliab.
A. Aubert, Sébastien Jacques, S. Pétremont, Nathalie Labat, Hélène Frémont
2011 J jnl
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps.
Microelectron. Reliab.
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
2010 J jnl
A fast moisture sensitivity level qualification method.
Microelectron. Reliab.
Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
2010 J jnl
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing.
Microelectron. Reliab.
A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont
2010 J jnl
Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications.
Microelectron. Reliab.
Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman, Manoubi Auguste Bahi
2009 J jnl
A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages.
Microelectron. Reliab.
Manoubi Auguste Bahi, Hélène Frémont, Jean-Pierre Landesman, Annabelle Gentil, Pascal Lecuyer
2009 J jnl
Fast reliability qualification of SiP products.
Microelectron. Reliab.
Charles Regard, Christian Gautier, Hélène Frémont, Patrick Poirier, Xiaosong Ma, Kaspar M. B. Jansen
2009 J jnl
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage.
Microelectron. Reliab.
Maxime Berthou, P. Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, C. Jéphos-Davennel
2007 J jnl
Dynamic void formation in a DD-copper-structure with different metallization geometry.
Microelectron. Reliab.
Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont
2007 J jnl
Sequential environmental stresses tests qualification for automotive components.
Microelectron. Reliab.
Manoubi Auguste Bahi, Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman
2007 J jnl
Torsion test applied for reballing and solder paste volume evaluation.
Microelectron. Reliab.
W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto
2006 J jnl
Improved physical understanding of intermittent failure in continuous monitoring method.
Microelectron. Reliab.
W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto
2005 J jnl
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations.
Microelectron. Reliab.
Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont
2004 J jnl
How to study delamination in plastic encapsulated devices.
Microelectron. Reliab.
Hélène Frémont, Jean-Yves Delétage, Kirsten Weide-Zaage, Yves Danto