Hua Lu

12 papers Journal 12
YearRankTypeTitle / Venue / Authors
2018 J jnl
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectron. Reliab.
Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey
2017 J jnl
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
Microelectron. Reliab.
Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise
2015 J jnl
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.
Microelectron. Reliab.
Pushparajah Rajaguru, Hua Lu, Chris Bailey
2015 J jnl
False shares in verifiable secret sharing with finite field commitments.
CoRR
Hua Lu, Jack Peterson
2015 J jnl
Sintered silver finite element modelling and reliability based design optimisation in power electronic module.
Microelectron. Reliab.
Pushparajah Rajaguru, Hua Lu, Chris Bailey
2011 J jnl
Integration of analytical techniques in stochastic optimization of microsystem reliability.
Microelectron. Reliab.
Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov
2010 J jnl
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects.
Microelectron. Reliab.
E. Kamara, Hua Lu, Chris Bailey, Chris Hunt, Davide Di Maio, Owen Thomas
2009 J jnl
Design for reliability of power electronics modules.
Microelectron. Reliab.
Hua Lu, Chris Bailey, Chunyan Yin
2008 J jnl
Failure mechanisms of ACF joints under isothermal ageing.
Microelectron. J.
M. J. Rizvi, Chris Bailey, Hua Lu
2005 J jnl
Study of anisotropic conductive adhesive joint behavior under 3-point bending.
Microelectron. Reliab.
M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu
2003 J jnl
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectron. Reliab.
Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu
2002 J jnl
No-flow underfill flip chip assembly--an experimental and modeling analysis.
Microelectron. Reliab.
Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan