| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ISSCC
|
| 2026 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | — | conf |
ISSCC
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | — | conf |
ISSCC
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2025 | J | jnl |
IEICE Electron. Express
|
| 2025 | J | jnl |
IEICE Electron. Express
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Commun. Lett.
|
| 2025 | A* | conf |
ICML
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Sci. China Inf. Sci.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2024 | — | conf |
ISSCC
|
| 2024 | — | conf |
VLSI Technology and Circuits
|
| 2024 | — | conf |
A-SSCC
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | — | conf |
CICC
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | — | conf |
ICTA
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2024 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2023 | — | conf |
ISSCC
|
| 2023 | — | conf |
ASICON
|
| 2023 | C | conf |
ISCAS
|
| 2023 | — | conf |
ISSCC
|
| 2023 | — | conf |
ASICON
|
| 2023 | — | conf |
ISSCC
|
| 2023 | — | conf |
ASICON
|
| 2023 | — | conf |
A 50μW Ring-Type Complementary Inverse-Class-D Oscillator with 191.4dBc/Hz FoM and 205.6dBc/Hz FoMA.
VLSI Technology and Circuits
|
| 2023 | — | conf |
ICTA
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
Microelectron. J.
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | — | conf |
ASICON
|
| 2022 | J | jnl |
IEEE J. Solid State Circuits
|
| 2022 | C | conf |
ISCAS
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
A 0.9V 0.1-4GHz LNTA in 28-nm CMOS Achieving +11.3dBm IIP3 With Self-loaded Linearization Technique.
ASICON
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | C | conf |
ISCAS
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
ASICON
|
| 2021 | — | conf |
SPIoT (1)
|
| 2021 | — | conf |
ISSCC
|
| 2020 | — | conf |
ISSCC
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | — | conf |
ICTA
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | J | jnl |
Libr. Hi Tech
|
| 2020 | C | conf |
ISCAS
|
| 2019 | — | conf |
ISSCC
|
| 2019 | J | jnl |
IEEE J. Solid State Circuits
|
| 2019 | J | jnl |
IEEE J. Solid State Circuits
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2018 | — | conf |
CICC
|
| 2018 | — | conf |
ISSCC
|
| 2017 | — | conf |
ISSCC
|
| 2015 | — | conf |
IEEE RFID
|
| 2012 | J | jnl |
IEEE J. Solid State Circuits
|
| 2012 | — | conf |
ISSCC
|
| 2012 | J | jnl |
IEEE J. Solid State Circuits
|
| 2011 | — | conf |
ESSCIRC
|
| 2011 | J | jnl |
A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application.
IEEE J. Solid State Circuits
|
| 2011 | — | conf |
ISSCC
|
| 2011 | — | conf |
BIBM Workshops
|
| 2010 | — | conf |
ESSCIRC
|
| 2009 | B | conf |
MMM
|
| 2009 | — | conf |
APWeb/WAIM
|
| 2009 | — | conf |
CIVR
|
| 2008 | A* | conf |
ICDE
|
| 2008 | A* | conf |
SIGIR
|
| 2008 | C | conf |
APWeb
|
| 2007 | — | conf |
PCM
|
| 2006 | — | conf |
3DPVT
|
| 2005 | Misc | conf |
International Conference on Computational Science (1)
|