| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | — | conf |
OFC
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Complex Intell. Syst.
|
| 2025 | J | jnl |
Soft Comput.
|
| 2025 | A* | conf |
CVPR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Asia Pac. J. Oper. Res.
|
| 2025 | — | conf |
ECOC
|
| 2025 | — | conf |
EMNLP (Industry Track)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
OFC
|
| 2025 | A | conf |
CIKM
|
| 2025 | J | jnl |
CoRR
|
| 2024 | — | conf |
OFC
|
| 2024 | — | conf |
OFC
|
| 2024 | — | conf |
ICTA
|
| 2024 | J | jnl |
Mob. Networks Appl.
|
| 2024 | — | conf |
OFC
|
| 2024 | A* | conf |
CVPR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
SIGIR
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2024 | — | conf |
ACL (1)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2024 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2023 | — | conf |
OFC
|
| 2023 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2023 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Int. J. Comput. Vis.
|
| 2023 | J | jnl |
IEEE Trans. Multim.
|
| 2023 | — | conf |
OFC
|
| 2022 | — | conf |
OFC
|
| 2022 | J | jnl |
Wirel. Pers. Commun.
|
| 2022 | J | jnl |
Wirel. Pers. Commun.
|
| 2022 | — | conf |
ACCV (5)
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2022 | — | conf |
OECC/PSC
|
| 2021 | — | conf |
PRICAI (3)
|
| 2021 | A* | conf |
CVPR
|
| 2021 | — | conf |
MMM (1)
|
| 2021 | J | jnl |
Secur. Commun. Networks
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2021 | A* | conf |
CVPR
|
| 2020 | — | conf |
ECOC
|
| 2020 | — | conf |
OFC
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2020 | — | conf |
ECCV (5)
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Comput. Animat. Virtual Worlds
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2019 | A* | conf |
CVPR
|
| 2019 | J | jnl |
CoRR
|
| 2019 | A* | conf |
CVPR
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
Appl. Intell.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | A | conf |
WACV
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | A* | conf |
CVPR
|
| 2018 | J | jnl |
CoRR
|
| 2018 | C | conf |
HealthCom
|
| 2018 | J | jnl |
Nat. Comput.
|
| 2018 | C | conf |
ICCC
|
| 2018 | — | conf |
ECCV Workshops (2)
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
CoRR
|
| 2018 | — | conf |
ECCV (16)
|
| 2018 | J | jnl |
CoRR
|
| 2018 | A* | conf |
CVPR
|
| 2018 | J | jnl |
CoRR
|
| 2017 | C | conf |
IECON
|
| 2017 | — | conf |
ASICON
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2016 | — | conf |
ACA
|
| 2016 | — | conf |
NCCET
|
| 2016 | C | conf |
HealthCom
|
| 2016 | — | conf |
ACA
|
| 2016 | — | conf |
OFC
|
| 2016 | J | jnl |
Expert Syst. Appl.
|
| 2016 | — | conf |
GLOBECOM Workshops
|
| 2016 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2015 | — | conf |
ASICON
|
| 2014 | — | conf |
OFC
|
| 2014 | — | conf |
CyberC
|
| 2014 | J | jnl |
J. Electr. Comput. Eng.
|
| 2014 | J | jnl |
Appl. Intell.
|
| 2014 | J | jnl |
Entropy
|
| 2014 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2013 | A | conf |
ICME
|
| 2013 | J | jnl |
J. Supercomput.
|
| 2012 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2011 | A | conf |
ICME
|
| 2011 | — | conf |
ICAIC (4)
|
| 2010 | — | conf |
CNSR
|
| 2010 | A | conf |
ICME
|
| 2010 | B | conf |
GLOBECOM
|
| 2010 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2005 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2004 | J | jnl |
IEEE Trans. Consumer Electron.
|