| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | — | conf |
ISVLSI
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | — | conf |
NewCAS
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | — | conf |
ICAIE
|
| 2024 | J | jnl |
A 3.58 nJ/Node Dual Cross Correlation Analog-Front-End Circuit With ADC for Mutual Capacitive Panel.
IEEE J. Solid State Circuits
|
| 2024 | — | conf |
ISVLSI
|
| 2024 | — | conf |
ISVLSI
|
| 2024 | — | conf |
ISVLSI
|
| 2024 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | — | conf |
ASICON
|
| 2023 | — | conf |
MobiSec
|
| 2022 | J | jnl |
Microelectron. J.
|
| 2022 | J | jnl |
Sensors
|
| 2022 | — | conf |
NEWCAS
|
| 2022 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2022 | C | conf |
ISCAS
|
| 2022 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2020 | C | conf |
ISCAS
|
| 2019 | — | conf |
SoCC
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2018 | J | jnl |
Neurocomputing
|
| 2017 | — | conf |
ASICON
|
| 2017 | J | jnl |
Microelectron. J.
|
| 2017 | — | conf |
ASICON
|
| 2017 | J | jnl |
Int. J. Commun. Syst.
|
| 2015 | J | jnl |
Microelectron. Reliab.
|
| 2015 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2014 | C | conf |
ISCAS
|
| 2013 | — | conf |
GreenCom/iThings/CPScom
|
| 2013 | J | jnl |
IEICE Electron. Express
|
| 2013 | — | conf |
GreenCom/iThings/CPScom
|
| 2013 | — | conf |
GreenCom/iThings/CPScom
|
| 2012 | — | conf |
An efficient spike-sorting for implantable neural recording microsystem using hybrid neural network.
EMBC
|
| 2012 | J | jnl |
Microelectron. Reliab.
|
| 2010 | J | jnl |
Microelectron. Reliab.
|
| 2006 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2005 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2005 | B | conf |
IJCNN
|