Hisashi Kino - RankMe

23 papers Journal 2Unranked 21

Year	Rank	Type	Title / Venue / Authors
2024	—	`conf`	Supression of TSV-Induced Stress by Using Negative Thermal Expansion Material. 3DIC Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2023	—	`conf`	Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction. BioCAS Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2023	—	`conf`	Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 3DIC Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
2022	J	`jnl`	3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration. IEICE Electron. Express Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2022	—	`conf`	Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip. BioCAS Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2021	—	`conf`	Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System. BioCAS Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2021	—	`conf`	Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. 3DIC Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan
2019	—	`conf`	Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. 3DIC Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2019	—	`conf`	Development of 3D-IC Embedded Flexible Hybrid System. 3DIC Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2019	—	`conf`	Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing. 3DIC Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2019	—	`conf`	Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation. 3DIC Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2019	—	`conf`	Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. 3DIC Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2019	—	`conf`	PPG and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System. BioCAS Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama
2018	—	`conf`	Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips. BioCAS Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2017	—	`conf`	Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip. BioCAS Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Kouji Kiyoyama, Tetsu Tanaka
2017	—	`conf`	Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current. BioCAS Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2016	—	`conf`	Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler. 3DIC Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2016	J	`jnl`	Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2016	—	`conf`	Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current. BioCAS Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino, Tetsu Tanaka
2015	—	`conf`	Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. 3DIC Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
2015	—	`conf`	Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors. 3DIC Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
2013	—	`conf`	Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics. EMBC Shota Kanno, Sang-Rim Lee, T. Harashima, Toshinobu Kuki, Hisashi Kino, Hajime Mushiake, Hongyi Yao, Tetsu Tanaka
2009	—	`conf`	Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi