Herman Oprins

25 papers C 1Misc 1Journal 12Unranked 11
YearRankTypeTitle / Venue / Authors
2026 J jnl
PINDAS: Physics-Informed Decoupled Spatiotemporal Artificial Neural Network for Dynamic Thermal Simulation.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
David Coenen, Herman Oprins
2025 J jnl
Iterative Layout-Aware Power, Thermal, and IR-Drop Co-Optimization: Ensuring Convergency in 3D-ICs.
IEEE J. Emerg. Sel. Topics Circuits Syst.
Mohamed Naeim, Dwaipayan Biswas, Yun Dai, Odysseas Zografos, Herman Oprins, Geert Van der Plas, CT Kao, Pinhong Chen, Dragomir Milojevic
2025 J jnl
Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology.
CoRR
Yukai Chen, Massimiliano Di Todaro, Bjorn Vermeersch, Herman Oprins, Daniele Jahier Pagliari, Julien Ryckaert, Dwaipayan Biswas, James Myers
2024 J jnl
Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures.
IEEE Trans. Very Large Scale Integr. Syst.
Leandro Mateus Giacomini Rocha, Refik Bilgic, Mohamed Naeim, Sudipta Das, Herman Oprins, Amirreza Yousefzadeh, Mario Konijnenburg, Dragomir Milojevic, James Myers, Julien Ryckaert, Dwaipayan Biswas
2024 — conf
Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC.
ISVLSI
Mohamed Naeim, Herman Oprins, Sudipta Das, Geert Van der Plas, Yun Dai, Pinhong Chen, CT Kao, Dwaipayan Biswas, Dragomir Milojevic
2024 — conf
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5).
VLSI Technology and Circuits
S. Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, Gioele Mirabelli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert
2024 — conf
Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation.
IRPS
Subrat Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, A. Sharma, G. Mirabeli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert
2023 J jnl
Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
David Coenen, Herman Oprins, Robin Degraeve, Ingrid De Wolf
2023 Misc conf
Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator.
PSC
David Coenen, Minkyu Kim, Herman Oprins, Ingrid De Wolf, Yoojin Ban, Joris Van Campenhout
2023 J jnl
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.
IEEE Trans. Very Large Scale Integr. Syst.
Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Dwaipayan Biswas, Pieter Weckx, Francky Catthoor
2023 — conf
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).
IRPS
Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert
2023 — conf
Towards accurate temperature prediction in BEOL for reliability assessment (Invited).
IRPS
Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
2022 J jnl
Thermal Performance Analysis of Mempool RISC-V Multicore SoC.
IEEE Trans. Very Large Scale Integr. Syst.
Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Pieter Weckx, Francky Catthoor
2019 — conf
Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.
IRPS
Kris Croes, Veerle Simons, Sofie Beyne, Vladimir Cherman, Herman Oprins, Michele Stucchi, Philippe Absil, A. Glabman, Eric Wilcox
2016 — conf
New fast distributed thermal model for analysis of GaN based power devices.
ESSDERC
Vice Sodan, Federica Lidia Teresa Maggioni, Herman Oprins, Steve Stoffels, Martine Baelmans, Ingrid De Wolf
2015 — conf
Thermal experimental and modeling analysis of high power 3D packages.
ICICDT
Herman Oprins, Vladimir Cherman, Geert Van der Plas, F. L. T. Maggioni, Joeri De Vos, Eric Beyne
2014 J jnl
Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact.
Microelectron. J.
F. L. T. Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans
2012 J jnl
Modeling and Control of Electrowetting Induced Droplet Motion.
Micromachines
Herman Oprins, Bart Vandevelde, Martine Baelmans
2011 — conf
DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow.
CICC
Dragomir Milojevic, Herman Oprins, Julien Ryckaert, Paul Marchal, Geert Van der Plas
2011 J jnl
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits
Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
2011 J jnl
Fine grain thermal modeling and experimental validation of 3D-ICs.
Microelectron. J.
Herman Oprins, Adi Srinivasan, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng
2010 C conf
3D integration: Circuit design, test, and reliability challenges.
IOLTS
Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal
2010 — conf
Design issues and considerations for low-cost 3D TSV IC technology.
ISSCC
Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne
2010 — conf
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.
CICC
Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
2008 J jnl
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling.
Microelectron. J.
Herman Oprins, J. Danneels, B. Van Ham, Bart Vandevelde, Martine Baelmans