Herbert Reichl

24 papers C 1Misc 3Journal 13Unranked 6
YearRankTypeTitle / Venue / Authors
2011 J jnl
Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds.
Microelectron. Reliab.
Thomas Schreier-Alt, Frank Rehme, Frank Ansorge, Herbert Reichl
2010 J jnl
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.
Microelectron. Reliab.
Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl
2009 — conf
3-D thin chip integration technology - from technology development to application.
3DIC
Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl
2009 — conf
Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes.
MBMV
Herbert Reichl, Ivan N. Ndip
2009 — conf
SENESCOPE: A design tool for cost optimization of wireless sensor nodes.
IPSN
M. Niedermayer, C. Richter, J. Hefer, Stephan Guttowski, Herbert Reichl
2009 Misc conf
Stretchable Circuit Board Technology and Application.
ISWC
Rene Vieroth, Thomas Löher, Manuel Seckel, Christian Dils, Christine Kallmayer, Andreas Ostmann, Herbert Reichl
2008 J jnl
Lamination And Microstructuring Technology for a Bio-Cell Multiwell array
CoRR
Erik Jung, Dionysios Manessis, Alexander Neumann, Lars Böttcher, Tanja Braun, Jörg Bauer, Herbert Reichl, Bruno Iafelice, Federica Destro, Roberto Gambari
2008 J jnl
Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators
CoRR
Robert Hahn, Stefan Wagner, Steffen Krumbholz, Herbert Reichl
2008 J jnl
Technologies for 3D Heterogeneous Integration
CoRR
Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl
2006 C conf
Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics.
BSN
Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
2006 J jnl
High-temperature reliability of Flip Chip assemblies.
Microelectron. Reliab.
Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl
2006 — conf
Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies.
IPSN
M. Niedermayer, Stephan Guttowski, Rolf Thomasius, David Dmitry Polityko, K. Schrank, Herbert Reichl
2006 — conf
Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV.
EMV
Stefan-Peter Weber, André Linde, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl
2006 — conf
Vorhersage von magnetischen Kopplungen in Filterschaltungen.
EMV
Andre Lissner, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl
2005 J jnl
Characterization of bump arrays at RF/microwave frequencies.
Microelectron. Reliab.
Ivan N. Ndip, Grit Sommer, Werner John, Herbert Reichl
2005 J jnl
Closed-form network representations of frequency-dependent
Int. J. Circuit Theory Appl.
A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer, Herbert Reichl
2005 Misc conf
Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric.
ISWC
Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
2005 — ch.
Packaging Challenges in Miniaturization.
Ambient Intelligence
Christine Kallmayer, M. Niedermayer, Stephan Guttowski, Herbert Reichl
2005 J jnl
Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications.
Microelectron. Reliab.
Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl
2004 J jnl
Long time reliability study of soldered flip chips on flexible substrates.
Microelectron. Reliab.
Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl
2004 J jnl
Parametric FE-approach to flip-chip reliability under various loading conditions.
Microelectron. Reliab.
Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl
2004 J jnl
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping.
Microelectron. Reliab.
Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl
2002 J jnl
Bump formation for flip chip and CSP by solder paste printing.
Microelectron. Reliab.
Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl
1999 Misc conf
Batteries and Power Supplies for Wearable and Ubiquitous Computing.
ISWC
Robert Hahn, Herbert Reichl