| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | — | conf |
COOL CHIPS
|
| 2023 | — | conf |
ISSCC
|
| 2023 | — | conf |
ISSCC
|
| 2023 | J | jnl |
IEEE Micro
|
| 2023 | J | jnl |
CoRR
|
| 2022 | — | conf |
COOL CHIPS
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2021 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | C | conf |
ISCAS
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
MCSoC
|
| 2019 | — | conf |
MCSoC
|
| 2019 | — | conf |
CANDAR Workshops
|
| 2018 | — | conf |
MCSoC
|
| 2018 | J | jnl |
Analysis of Body Bias Control Using Overhead Conditions for Real Time Systems: A Practical Approach.
IEICE Trans. Inf. Syst.
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | J | jnl |
IEEE Trans. Multi Scale Comput. Syst.
|
| 2018 | — | conf |
COOL CHIPS
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2018 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2018 | — | conf |
HEART
|
| 2017 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2017 | — | conf |
COOL Chips
|
| 2017 | B | conf |
FPL
|
| 2017 | — | conf |
ReConFig
|
| 2017 | — | conf |
COOL Chips
|
| 2017 | — | conf |
MCSoC
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | B | conf |
FPL
|
| 2016 | — | conf |
COOL Chips
|
| 2016 | — | conf |
FPT
|
| 2015 | B | conf |
FPL
|
| 2015 | — | conf |
ReConFig
|
| 2015 | — | conf |
COOL Chips
|
| 2015 | A | conf |
ISLPED
|
| 2015 | — | conf |
CANDAR
|