Haruo Shimamoto

15 papers Journal 7Unranked 8
YearRankTypeTitle / Venue / Authors
2021 J jnl
Analysis and evaluation of noise coupling between through-silicon-vias.
IEICE Electron. Express
Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi
2021 J jnl
Landside capacitor efficacy among multi-chip-module using Si-interposer.
IEICE Electron. Express
Yuuki Araga, Ryo Kasai, Daisuke Tanaka, Yoshihide Murakami, Kyoshi Mihara, Kazuo Makida, Hiroki Sonoda, Makoto Nagata, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi
2020 J jnl
Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices.
IEEE J. Solid State Circuits
Takuji Miki, Makoto Nagata, Hiroki Sonoda, Noriyuki Miura, Takaaki Okidono, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi
2019 — conf
A Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices.
A-SSCC
Takuji Miki, Makoto Nagata, Hiroki Sonoda, Noriyuki Miura, Takaaki Okidono, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi
2019 — conf
Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs.
3DIC
Takuji Miki, Makoto Nagata, Akihiro Tsukioka, Noriyuki Miura, Takaaki Okidono, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi
2019 — conf
Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core.
3DIC
Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi
2017 J jnl
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits.
Microelectron. Reliab.
Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
2016 J jnl
Fabrication and stress analysis of annular-trench-isolated TSV.
Microelectron. Reliab.
Wei Feng, Tung Thanh Bui, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi
2016 J jnl
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits.
Microelectron. Reliab.
Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
2016 J jnl
Validation of TSV thermo-mechanical simulation by stress measurement.
Microelectron. Reliab.
Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi
2016 — conf
Wet cleaning process for high-yield via-last TSV formation.
3DIC
Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi, Hidekazu Kikuchi, Azusa Yanagisawa, Akio Nakamura
2014 — conf
Analysis of thermal stress distribution for TSV with novel structure.
3DIC
Wei Feng, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi
2011 — conf
Development of high accuracy wafer thinning and pickup technology for thin wafer.
3DIC
Kosuke Kitaichi, Haruo Shimamoto, Chuichi Miyazaki, Yoshiyuki Abe, Sigeaki Saito, Shoji Yasunaga
2010 — conf
Development of high accuracy wafer thinning and pickup technology for thin wafer.
3DIC
Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe, Kosuke Kitaichi, Tadahiro Morifuji, Shoji Yasunaga
2009 — conf
Development of wafer thinning and dicing technology for thin wafer.
3DIC
Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe