| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2026 | J | jnl |
Environ. Model. Softw.
|
| 2025 | — | conf |
NAACL (Long Papers)
|
| 2025 | J | jnl |
IEEE Commun. Mag.
|
| 2025 | J | jnl |
Comput. Mater. Continua
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
Vietnam. J. Comput. Sci.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ICC
|
| 2025 | J | jnl |
Comput. Mater. Continua
|
| 2025 | — | conf |
GECCO Companion
|
| 2024 | — | conf |
LREC/COLING
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Appl. Soft Comput.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ADMA (1)
|
| 2022 | — | conf |
NLPIR
|
| 2022 | J | jnl |
J. Comput. Inf. Sci. Eng.
|
| 2021 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
SSPS
|
| 2019 | J | jnl |
Sensors
|