| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | A* | conf |
AAAI
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
Vis. Comput.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | B | conf |
IJCNN
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ICANN (4)
|
| 2025 | J | jnl |
CoRR
|
| 2024 | — | conf |
WI/IAT
|
| 2024 | — | conf |
WI/IAT
|
| 2024 | J | jnl |
IEEE Trans. Vis. Comput. Graph.
|
| 2024 | — | conf |
WI/IAT
|
| 2024 | — | conf |
WI/IAT
|
| 2023 | — | conf |
WI/IAT
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2020 | Misc | conf |
NSDI
|
| 2020 | — | conf |
CSAE
|
| 2020 | — | conf |
DSC
|
| 2019 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2019 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2019 | — | conf |
I2MTC
|
| 2019 | — | conf |
MACIS
|
| 2018 | — | conf |
I2MTC
|
| 2018 | — | conf |
ICPHM
|
| 2018 | — | conf |
I2MTC
|
| 2018 | J | jnl |
Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging.
IEEE Trans. Ind. Informatics
|
| 2017 | Misc | conf |
ICCS
|
| 2015 | — | conf |
MILCOM
|
| 2013 | — | conf |
ITQM
|
| 2012 | — | conf |
ISCTCS
|