| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Signal Process. Lett.
|
| 2025 | B | conf |
SMC
|
| 2025 | — | conf |
ICIC (10)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
PeerJ Comput. Sci.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
CMMCA@MICCAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Medical Image Anal.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Signal Process. Lett.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2025 | J | jnl |
J. Supercomput.
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2024 | A* | conf |
IJCAI
|
| 2024 | B | conf |
WCNC
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2022 | B | conf |
COLING
|
| 2020 | J | jnl |
J. Netw. Comput. Appl.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | B | conf |
FG
|
| 2020 | J | jnl |
CoRR
|
| 2019 | — | conf |
ICC
|
| 2017 | — | conf |
ICIIP
|
| 2014 | J | jnl |
Mach. Vis. Appl.
|
| 2014 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2013 | J | jnl |
ACM Trans. Reconfigurable Technol. Syst.
|
| 2011 | — | conf |
SI3D
|
| 2011 | — | conf |
WCSP
|
| 2011 | — | conf |
SIGGRAPH Asia Posters
|
| 2010 | B | conf |
ICPR
|
| 2010 | — | conf |
SIGGRAPH Talks
|
| 2010 | J | jnl |
Int. J. Reconfigurable Comput.
|
| 2008 | Misc | conf |
FCCM
|
| 2008 | B | conf |
FPL
|
| 2005 | — | conf |
ISPA Workshops
|
| 1995 | J | jnl |
Signal Process.
|