| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
Int. J. Appl. Earth Obs. Geoinformation
|
| 2023 | J | jnl |
Data
|
| 2021 | J | jnl |
Vis. Comput.
|
| 2019 | — | conf |
ICETE (1)
|
| 2017 | — | — |
|
| 2015 | J | jnl |
Microelectron. J.
|
| 2015 | J | jnl |
Sensors
|
| 2014 | J | jnl |
J. Inf. Sci. Eng.
|
| 2014 | J | jnl |
J. Inf. Sci. Eng.
|
| 2011 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2011 | J | jnl |
J. Knowl. Manag.
|
| 2010 | — | conf |
ICA3PP (1)
|
| 2009 | J | jnl |
IEEE J. Solid State Circuits
|
| 2008 | — | conf |
A 45nm 4Gb 3-Dimensional Double-Stacked Multi-Level NAND Flash Memory with Shared Bitline Structure.
ISSCC
|
| 2008 | — | conf |
eScience
|
| 2001 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2000 | C | conf |
VCIP
|
| 2000 | A | conf |
ICCAD
|
| 2000 | — | conf |
CICC
|
| 1999 | — | conf |
ASP-DAC
|