| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | — | conf |
DSP
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
Computational Analysis of Indoor Thermal Comfort in a Terraced Family House With Thermal Insulation.
IEEE Access
|
| 2023 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Neural Comput. Appl.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
ICCCI (CCIS Volume)
|
| 2020 | J | jnl |
Sensors
|
| 2019 | J | jnl |
Symmetry
|
| 2017 | J | jnl |
Sensors
|
| 2017 | J | jnl |
Signal Image Video Process.
|
| 2017 | — | conf |
DSP
|
| 2016 | — | conf |
IWCIM
|
| 2015 | — | conf |
IWCIM
|
| 2013 | J | jnl |
Comput. Appl. Eng. Educ.
|