| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
IEEE Trans. Reliab.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
Neurocomputing
|
| 2025 | J | jnl |
IEEE Trans. Reliab.
|
| 2025 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2024 | J | jnl |
Appl. Soft Comput.
|
| 2024 | J | jnl |
Knowl. Based Syst.
|
| 2024 | J | jnl |
Appl. Soft Comput.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2024 | J | jnl |
Neural Process. Lett.
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Adv. Eng. Informatics
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
Digit. Signal Process.
|
| 2023 | J | jnl |
Deep stacked pinball transfer matrix machine with its application in roller bearing fault diagnosis.
Eng. Appl. Artif. Intell.
|
| 2023 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2023 | J | jnl |
Inf. Sci.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2022 | J | jnl |
Expert Syst. Appl.
|
| 2022 | J | jnl |
Entropy
|
| 2022 | J | jnl |
Knowl. Based Syst.
|
| 2022 | J | jnl |
Adv. Eng. Informatics
|
| 2022 | J | jnl |
Appl. Soft Comput.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | J | jnl |
Knowl. Based Syst.
|
| 2021 | J | jnl |
Appl. Soft Comput.
|
| 2021 | A | conf |
DATE
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Digit. Signal Process.
|
| 2021 | J | jnl |
Appl. Soft Comput.
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Appl. Soft Comput.
|
| 2020 | J | jnl |
Neurocomputing
|
| 2020 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Comput. Ind.
|
| 2019 | — | conf |
HPCC/SmartCity/DSS
|
| 2019 | J | jnl |
Entropy
|
| 2019 | J | jnl |
Digit. Signal Process.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Entropy
|
| 2018 | J | jnl |
Signal Process.
|
| 2018 | J | jnl |
Entropy
|
| 2018 | J | jnl |
Entropy
|
| 2017 | J | jnl |
Entropy
|
| 2017 | J | jnl |
Signal Process.
|
| 2017 | C | conf |
ICCD
|
| 2016 | — | conf |
Twin-Load: Bridging the Gap between Conventional Direct-Attached and Buffer-on-Board Memory Systems.
MEMSYS
|
| 2015 | J | jnl |
CoRR
|
| 2014 | B | conf |
VEE
|