| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | C | conf |
ISCAS
|
| 2025 | Misc | conf |
FCCM
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | — | conf |
ASPLOS (1)
|
| 2025 | J | jnl |
CoRR
|
| 2024 | — | conf |
Euro-Par (2)
|
| 2024 | J | jnl |
ACM Trans. Reconfigurable Technol. Syst.
|
| 2024 | — | conf |
ICCBR Workshops
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CAAI Trans. Intell. Technol.
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2023 | J | jnl |
IEEE Trans. Multim.
|
| 2023 | — | conf |
CVPR Workshops
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
IEEE Trans. Medical Imaging
|
| 2023 | J | jnl |
Appl. Intell.
|
| 2023 | — | conf |
MCGE@MM
|
| 2023 | Misc | conf |
ICASSP
|
| 2023 | A* | conf |
ICCV
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2022 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
CoRR
|
| 2021 | A* | conf |
AAAI
|
| 2021 | J | jnl |
IET Comput. Vis.
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2021 | J | jnl |
IEEE Trans. Multim.
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Cogn. Dev. Syst.
|
| 2021 | J | jnl |
Biomed. Signal Process. Control.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | A | conf |
WACV
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Multim. Tools Appl.
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | J | jnl |
IEICE Electron. Express
|
| 2017 | — | conf |
EMBC
|
| 2017 | — | conf |
CISP-BMEI
|
| 2017 | — | conf |
CISP-BMEI
|
| 2017 | — | conf |
DSC
|
| 2016 | — | conf |
SKG
|
| 2009 | — | conf |
PACCS
|
| 2008 | J | jnl |
Inf. Process. Lett.
|
| 2006 | — | conf |
IMSCCS (1)
|
| 2006 | C | conf |
EUC
|
| 2006 | C | conf |
ISPEC
|
| 2006 | — | conf |
ICICIC (1)
|