| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2025 | A* | conf |
DAC
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | A | conf |
ICCAD
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | A | conf |
Enforcing hard constraints in physics-informed learning for transient TSV electromigration analysis.
ICCAD
|
| 2024 | B | conf |
ASPDAC
|
| 2024 | B | conf |
ASPDAC
|
| 2023 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2023 | J | jnl |
ACM Trans. Multim. Comput. Commun. Appl.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | B | conf |
COMPSAC
|
| 2022 | A* | conf |
AAAI
|
| 2022 | A | conf |
WACV
|
| 2022 | J | jnl |
IEICE Electron. Express
|
| 2022 | J | jnl |
CoRR
|
| 2022 | — | conf |
ICSRS
|
| 2022 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2021 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | J | jnl |
ACM Trans. Internet Things
|
| 2021 | — | conf |
CDC
|
| 2021 | J | jnl |
ACM Trans. Intell. Syst. Technol.
|
| 2021 | A | conf |
WACV
|
| 2021 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2020 | — | conf |
ICCE-Berlin
|
| 2020 | A | conf |
DATE
|
| 2020 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2020 | — | conf |
APCCAS
|
| 2020 | J | jnl |
IEEE Trans. Circuits Syst.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | — | conf |
APCCAS
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
ASICON
|
| 2019 | J | jnl |
Integr.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
ASICON
|
| 2019 | A | conf |
ICCAD
|
| 2019 | Misc | conf |
SEC
|
| 2019 | — | conf |
ASICON
|
| 2019 | — | conf |
ASICON
|
| 2019 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2017 | — | conf |
SMACD
|
| 2017 | — | conf |
ASICON
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | — | conf |
ASICON
|
| 2016 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | A | conf |
ICCAD
|
| 2016 | — | conf |
ASP-DAC
|
| 2016 | A | conf |
DATE
|
| 2016 | C | conf |
ISCAS
|
| 2016 | J | jnl |
J. Frankl. Inst.
|
| 2016 | — | conf |
ISVLSI
|
| 2016 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2016 | — | conf |
Thermal modeling for energy-efficient smart building with advanced overfitting mitigation technique.
ASP-DAC
|
| 2015 | J | jnl |
Int. J. Circuit Theory Appl.
|
| 2015 | A* | conf |
DAC
|
| 2015 | A | conf |
ICCAD
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | — | conf |
SoCC
|
| 2015 | J | jnl |
Neurocomputing
|
| 2014 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2014 | A | conf |
ICCAD
|
| 2014 | A | conf |
ICCAD
|
| 2012 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2012 | J | jnl |
J. Frankl. Inst.
|
| 2012 | J | jnl |
Time Domain Model Order Reduction of General Orthogonal Polynomials for Linear Input-Output Systems.
IEEE Trans. Autom. Control.
|