| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2026 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Multim. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | — | conf |
IMMS
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | A | conf |
MobiSys
|
| 2022 | J | jnl |
Neuromorph. Comput. Eng.
|
| 2018 | — | conf |
ICNC-FSKD
|
| 2016 | — | conf |
CISP-BMEI
|
| 2016 | J | jnl |
IEEE Veh. Technol. Mag.
|
| 2011 | — | conf |
ICICA (2)
|
| 2009 | — | conf |
JCAI
|
| 2008 | — | conf |
NCM (1)
|
| 2008 | — | conf |
NCM (1)
|
| 1998 | J | jnl |
J. Softw. Maintenance Res. Pract.
|