| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | A* | conf |
AAAI
|
| 2026 | J | jnl |
CoRR
|
| 2026 | — | conf |
EuroMLSys@EuroSys
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | B | conf |
ICPADS
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2025 | C | conf |
ICCD
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
ICCAD
|
| 2025 | J | jnl |
CoRR
|
| 2024 | A | conf |
ICCAD
|
| 2024 | A | conf |
DATE
|
| 2024 | A | conf |
DATE
|
| 2024 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
DAC
|
| 2024 | — | conf |
Euro-Par (1)
|
| 2024 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2024 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | C | conf |
ICCD
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
DAC
|
| 2024 | A* | conf |
DAC
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | A* | conf |
SP
|
| 2024 | A | conf |
DATE
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | A | conf |
DATE
|
| 2024 | J | jnl |
CoRR
|
| 2024 | B | conf |
ASPDAC
|
| 2023 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2023 | — | conf |
ICFPT
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | — | conf |
ICFPT
|
| 2023 | A | conf |
ICCAD
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
DAC
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
MobiCom
|
| 2023 | A | conf |
DATE
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A | conf |
FPGA
|
| 2023 | J | jnl |
CoRR
|
| 2022 | — | conf |
ISPD
|
| 2022 | — | conf |
ASP-DAC
|
| 2022 | C | conf |
ICCD
|
| 2022 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2021 | C | conf |
ISCAS
|
| 2021 | J | jnl |
J. Comput. Sci. Technol.
|
| 2021 | A* | conf |
DAC
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | A | conf |
ICCAD
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | Misc | conf |
FCCM
|
| 2021 | J | jnl |
CCF Trans. Pervasive Comput. Interact.
|
| 2021 | A* | conf |
DAC
|
| 2021 | A | conf |
ICCAD
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | Misc | conf |
FCCM
|
| 2020 | A | conf |
ICCAD
|
| 2020 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2020 | Misc | conf |
FCCM
|
| 2020 | B | conf |
FPL
|
| 2020 | Misc | conf |
FCCM
|
| 2020 | A* | conf |
DAC
|
| 2020 | — | conf |
HotEdge
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | — | conf |
LABELS/HAL-MICCAI/CuRIOUS@MICCAI
|
| 2019 | A | conf |
DATE
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2019 | A | conf |
FPGA
|
| 2019 | C | conf |
ISCAS
|
| 2019 | — | conf |
ASAP
|
| 2019 | — | conf |
FPT
|
| 2018 | A* | conf |
INFOCOM
|
| 2018 | A | conf |
ICCAD
|
| 2018 | A | conf |
FPGA
|
| 2018 | A | conf |
FPGA
|
| 2018 | Misc | conf |
FCCM
|
| 2018 | Misc | conf |
FCCM
|
| 2018 | A | conf |
FPGA
|
| 2018 | — | book |
|
| 2018 | A | conf |
FPGA
|
| 2018 | — | conf |
NVMSA
|
| 2018 | A | conf |
ICS
|
| 2017 | A | conf |
FPGA
|
| 2017 | A | conf |
ICCAD
|
| 2017 | A | conf |
FPGA
|
| 2017 | C | conf |
ICCD
|
| 2017 | A | conf |
FPGA
|
| 2017 | Misc | conf |
FCCM
|
| 2017 | C | conf |
ISCAS
|
| 2017 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2017 | A | conf |
ISLPED
|
| 2016 | C | conf |
ISCAS
|
| 2016 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2016 | A | conf |
ISLPED
|
| 2016 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2016 | — | conf |
ISPD
|
| 2016 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2016 | B | conf |
GLOBECOM
|
| 2015 | — | conf |
CAD/Graphics
|
| 2015 | A | conf |
ICCAD
|
| 2015 | — | conf |
ISPD
|
| 2015 | A | conf |
FPGA
|
| 2015 | Misc | conf |
SenSys
|
| 2014 | — | conf |
FPT
|
| 2014 | Misc | conf |
FCCM
|
| 2014 | C | conf |
ISCAS
|
| 2014 | Misc | conf |
SenSys
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | — | conf |
ISPD
|
| 2013 | — | conf |
ASP-DAC
|
| 2012 | A | conf |
ICCAD
|
| 2012 | — | conf |
ISPD
|
| 2011 | C | conf |
ISCAS
|
| 2011 | A | conf |
DATE
|
| 2011 | — | conf |
SoCC
|
| 2011 | — | conf |
ISOCC
|
| 2011 | A* | conf |
DAC
|
| 2010 | J | jnl |
Inf. Media Technol.
|
| 2010 | J | jnl |
IPSJ Trans. Syst. LSI Des. Methodol.
|
| 2010 | — | conf |
ISPD
|
| 2010 | — | conf |
3DIC
|
| 2009 | — | conf |
ASP-DAC
|
| 2008 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2008 | — | conf |
ISPD
|
| 2007 | — | conf |
ASP-DAC
|