Guo-Quan Lu

15 papers Journal 15
YearRankTypeTitle / Venue / Authors
2024 J jnl
Double-Sided Cooling Half-Bridge Power Module of 650V/150A Gallium Nitride High-Electron-Mobility Transistor.
IEEE Trans. Ind. Electron.
Shengchang Lu, Bo Li, Emmanuel Arriola, Zichen Zhang, Carl Nicholas, Khai D. T. Ngo, Guo-Quan Lu
2023 J jnl
Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors.
IEEE Trans. Ind. Electron.
Shengchang Lu, Tianyu Zhao, Zichen Zhang, Khai D. T. Ngo, Rolando Burgos, Guo-Quan Lu
2021 J jnl
Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement.
IEEE Trans. Ind. Electron.
Shan Gao, Khai D. T. Ngo, Guo-Quan Lu
2017 J jnl
Over-Molded Inductor (OMI) - Feasibility Demonstration in a DC-DC Converter.
IEEE Trans. Ind. Electron.
Ting Ge, Yi Yan, Guo-Quan Lu, Khai D. T. Ngo
2016 J jnl
Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection.
Microelectron. Reliab.
David Berry, Adrian Townsend, Weikun He, Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu
2015 J jnl
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions.
Microelectron. Reliab.
Haidong Yan, Yun-Hui Mei, Xin Li, Pu Zhang, Guo-Quan Lu
2015 J jnl
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate.
Microelectron. Reliab.
Su-Yan Zhao, Xin Li, Yun-Hui Mei, Guo-Quan Lu
2015 J jnl
Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules.
Microelectron. Reliab.
Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu
2013 J jnl
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force.
Microelectron. Reliab.
Xin Li, Gang Chen, Xu Chen, Guo-Quan Lu, Lei Wang, Yun-Hui Mei
2013 J jnl
Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging.
Microelectron. Reliab.
Gang Chen, Ze-Sheng Zhang, Yun-Hui Mei, Xin Li, Guo-Quan Lu, Xu Chen
2005 J jnl
Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling.
Microelectron. Reliab.
Y. C. Lin, Xu Chen, Xingsheng Liu, Guo-Quan Lu
2002 J jnl
Effect of substrate flexibility on solder joint reliability.
Microelectron. Reliab.
Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
2001 J jnl
Design issues of a three-dimensional packaging scheme for power modules.
Microelectron. Reliab.
Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dushan Boroyevich, Guo-Quan Lu
2001 J jnl
Effects of device passivation materials on solderable metallization of IGBTs.
Microelectron. Reliab.
Shatil Haque, Guo-Quan Lu
2001 J jnl
Stacked solder bumping technology for improved solder joint reliability.
Microelectron. Reliab.
Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard