Guanglan Liao

29 papers B 1C 1Journal 18Unranked 9
YearRankTypeTitle / Venue / Authors
2026 J jnl
Dynamic behavior monitoring of Glioma stem cells based on spatiotemporal prior and morphological constraints.
Biomed. Signal Process. Control.
Zihan Li, Xinyuan Zhang, Yujiao Song, Zhengqiong Dong, Yang Zhang, Zhong Zheng, Zhiyong Liu, Guanglan Liao, Lei Nie
2025 J jnl
Rapid rib lesion diagnosis based on improved YOLOv8 and Bytetrack algorithms enhanced multi-planar reconstruction.
Neurocomputing
Yue Zhou, Huasheng Zhuo, Donglin Wen, Yuran Gu, Zhiyong Liu, Gang Wu, Guanglan Liao, Tielin Shi
2024 J jnl
A Novel Chip-on-Board Defect Detection Approach Combining Infrared Thermal Evolution and Self-Supervised Transformer.
IEEE Trans. Ind. Informatics
Ye Jiang, Zhiyong Liu, Guanglan Liao, Bo Ma
2024 — conf
Ribtrack: Rib-Based Tracking for Multi-Planar Reconstruction: a Novel Approach to Automated Rib Multiplanar Reconstruction Using Yolov10 With Bytetrack.
CRC
Huasheng Zhuo, Yue Zhou, Donglin Wen, Dongwen Luo, Yuran Gu, Gang Wu, Tielin Shi, Zhiyong Liu, Guanglan Liao
2022 J jnl
MS-SSPCANet: A powerful deep learning framework for tool wear prediction.
Robotics Comput. Integr. Manuf.
Jian Duan, Cheng Hu, Xiaobin Zhan, Hongdi Zhou, Guanglan Liao, Tielin Shi
2018 J jnl
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm.
IEEE Trans. Ind. Informatics
Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi
2018 J jnl
Microscopic Three-Dimensional Measurement Based on Telecentric Stereo and Speckle Projection Methods.
Sensors
Kepeng Chen, Tielin Shi, Qiang Liu, Zirong Tang, Guanglan Liao
2018 J jnl
Using GA-SVM for defect inspection of flip chips based on vibration signals.
Microelectron. Reliab.
Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su
2017 J jnl
Using Wavelet Packet Transform for Surface Roughness Evaluation and Texture Extraction.
Sensors
Xiao Wang, Tielin Shi, Guanglan Liao, Yichun Zhang, Yuan Hong, Kepeng Chen
2017 J jnl
Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings.
Sensors
Hongdi Zhou, Tielin Shi, Guanglan Liao, Jianping Xuan, Jie Duan, Lei Su, Zhenzhi He, Wuxing Lai
2016 — conf
Machine fault classification using deep belief network.
I2MTC
Zhuyun Chen, Xueqiong Zeng, Weihua Li, Guanglan Liao
2016 J jnl
Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging.
Sensors
Yichun Zhang, Tielin Shi, Lei Su, Xiao Wang, Yuan Hong, Kepeng Chen, Guanglan Liao
2016 J jnl
X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm.
Microelectron. Reliab.
Junjie Shen, Pengfei Chen, Lei Su, Tielin Shi, Zirong Tang, Guanglan Liao
2015 J jnl
Genetic algorithms for defect detection of flip chips.
Microelectron. Reliab.
Lei Su, Tielin Shi, Li Du, Xiangning Lu, Guanglan Liao
2015 J jnl
Using RBF networks for detection and prediction of flip chip with missing bumps.
Microelectron. Reliab.
Guanglan Liao, Li Du, Lei Su, Miao Zeng, Lei Nie, Tielin Shi
2015 J jnl
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration.
Microelectron. Reliab.
Guanglan Liao, Pengfei Chen, Li Du, Lei Su, Zhiping Liu, Zirong Tang, Tielin Shi
2014 J jnl
Using active thermography for defects inspection of flip chip.
Microelectron. Reliab.
Zhensong Xu, Tielin Shi, Xiangning Lu, Guanglan Liao
2013 J jnl
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer.
Sensors
Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao
2013 J jnl
Image registration using a point-line duality based line matching method.
J. Vis. Commun. Image Represent.
Ke Wang, Tielin Shi, Guanglan Liao, Qi Xia
2012 J jnl
Defect detection of flip-chip solder joints using modal analysis.
Microelectron. Reliab.
Junchao Liu, Tielin Shi, Ke Wang, Zirong Tang, Guanglan Liao
2012 C conf
Finite element analysis on the micro-forming process of Zr-based bulk metallic glass.
CSCWD
Qiang Yu, Jun Wang, Weijie Zhang, Guanglan Liao
2011 — conf
A pattern matching method using geometric information of images.
NEMS
Ke Wang, Qi Xia, Tielin Shi, Guanglan Liao, Shiyuan Liu
2009 — conf
Improved adhesion between C-MEMS and substrate by micromechanical interlocking.
NEMS
Jie Gong, Zirong Tang, Tielin Shi, Guanglan Liao, Lei Nie, Shiyuan Liu
2009 — conf
Low temperature direct bonding for hermetic wafer level packaging.
NEMS
Lei Nie, Tielin Shi, Zirong Tang, Shiyuan Liu, Guanglan Liao
2009 — conf
Scratch of submicron grooves on aluminum film with AFM diamond tip.
NEMS
Ping Peng, Tielin Shi, Guanglan Liao, Zirong Tang, Chang Liu
2006 — conf
Pattern Discovery from Time Series Using Growing Hierarchical Self-Organizing Map.
ICONIP (1)
Shiyuan Liu, Li Lu, Guanglan Liao, Jianping Xuan
2005 — conf
A Novel Technique for Data Visualization Based on SOM.
ICANN (1)
Guanglan Liao, Tielin Shi, Shiyuan Liu, Jianping Xuan
2005 — conf
Feature Selection and Classification of Gear Faults Using SOM.
ISNN (3)
Guanglan Liao, Tielin Shi, Weihua Li, Tao Huang
2005 B conf
Feature selection and condition monitoring of gearbox using SOM.
IJCNN
Guanglan Liao, Tielin Shi, Jianping Xuan