Golta Khatibi

21 papers Journal 20Unranked 1
YearRankTypeTitle / Venue / Authors
2018 J jnl
Characterization of cyclic delamination behavior of thin film multilayers.
Microelectron. Reliab.
Thomas Walter, Golta Khatibi, Michael Nelhiebel, M. Stefenelli
2018 J jnl
Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl.
Microelectron. Reliab.
Bernhard Czerny, Golta Khatibi
2018 J jnl
Effect of aging on mechanical properties of high temperature Pb-rich solder joints.
Microelectron. Reliab.
Golta Khatibi, A. Betzwar Kotas, Martin Lederer
2017 J jnl
High cycle fatigue testing of thermosonic ball bonds.
Microelectron. Reliab.
Alice Lassnig, Martin Lederer, Golta Khatibi, Rainer Pelzer, W. Robl, Michael Nelhiebel
2017 J jnl
Isothermal bending fatigue response of solder joints in high power semiconductor test structures.
Microelectron. Reliab.
A. Betzwar Kotas, Golta Khatibi
2017 J jnl
Reliability of Cu wire bonds in microelectronic packages.
Microelectron. Reliab.
Ali Mazloum-Nejadari, Golta Khatibi, Bernhard Czerny, Martin Lederer, Johann Nicolics, L. Weiss
2017 J jnl
Wire bond degradation under thermo- and pure mechanical loading.
Microelectron. Reliab.
Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen
2016 J jnl
Delamination of polyimide/Cu films under mixed mode loading.
Microelectron. Reliab.
Thomas Walter, Martin Lederer, Golta Khatibi
2016 J jnl
Fatigue testing method for fine bond wires in an LQFP package.
Microelectron. Reliab.
Bernhard Czerny, Ali Mazloum-Nejadari, Golta Khatibi, Laurens Weiss, Michael Zehetbauer
2016 J jnl
Interface reliability and lifetime prediction of heavy aluminum wire bonds.
Microelectron. Reliab.
Bernhard Czerny, Golta Khatibi
2015 — conf
Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challenges.
IRPS
Ephraim Suhir, A. Bensoussan, Golta Khatibi, Johann Nicolics
2014 J jnl
A fast reliability assessment method for Si MEMS based microcantilever beams.
Microelectron. Reliab.
Peyman Rafiee, Golta Khatibi
2014 J jnl
Assessment of mechanical reliability of surface mounted capacitor by an accelerated shear fatigue test technique.
Microelectron. Reliab.
Julien Magnien, Golta Khatibi
2013 J jnl
Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages.
Microelectron. Reliab.
Peyman Rafiee, Golta Khatibi, N. Nelhiebel, Rainer Pelzer
2013 J jnl
Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects.
Microelectron. Reliab.
Bernhard Czerny, I. Paul, Golta Khatibi, Markus Thoben
2012 J jnl
High temperature storage reliability investigation of the Al-Cu wire bond interface.
Microelectron. Reliab.
Rainer Pelzer, Michael Nelhiebel, Robert Zink, Stefan Wöhlert, Alice Lassnig, Golta Khatibi
2012 J jnl
Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions.
Microelectron. Reliab.
Bernhard Czerny, Martin Lederer, Bernhard Nagl, Alexander Trnka, Golta Khatibi, Markus Thoben
2010 J jnl
A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects.
Microelectron. Reliab.
Bernhard Czerny, Golta Khatibi, Brigitte Weiss, T. Licht
2009 J jnl
A novel accelerated test technique for assessment of mechanical reliability of solder interconnects.
Microelectron. Reliab.
Golta Khatibi, W. Wroczewski, Brigitte Weiss, H. Ipser
2008 J jnl
A fast mechanical test technique for life time estimation of micro-joints.
Microelectron. Reliab.
Golta Khatibi, W. Wroczewski, Brigitte Weiss, T. Licht
2003 J jnl
Aluminum bond-wire properties after 1 billion mechanical cycles.
Microelectron. Reliab.
Guy Lefranc, Brigitte Weiss, Christof Klos, J. Dick, Golta Khatibi, H. Berg