| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2017 | J | jnl |
Microelectron. Reliab.
|
| 2013 | J | jnl |
Microelectron. J.
|
| 2013 | — | conf |
MIXDES
|
| 2009 | J | jnl |
Microelectron. J.
|
| 2008 | J | jnl |
Microelectron. Reliab.
|
| 2008 | — | conf |
DistIntellSys
|
| 2006 | J | jnl |
Microelectron. J.
|
| 2004 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2004 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2004 | J | jnl |
Microelectron. Reliab.
|
| 2003 | J | jnl |
Microelectron. Reliab.
|
| 1994 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 1990 | J | jnl |
Rigorous thermodynamic treatment of heat generation and conduction in semiconductor device modeling.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|