| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | — | conf |
NewCAS
|
| 2025 | J | jnl |
IEEE Trans. Sustain. Comput.
|
| 2025 | A* | conf |
ICLR
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | — | conf |
COINS
|
| 2024 | — | conf |
COINS
|
| 2024 | A | conf |
DATE
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
COINS
|
| 2023 | A | conf |
DATE
|
| 2023 | — | conf |
IWASI
|
| 2023 | A | conf |
DATE
|
| 2023 | J | jnl |
J. Syst. Archit.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
IET Comput. Digit. Tech.
|
| 2022 | J | jnl |
IEEE Netw.
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | Misc | conf |
SenSys
|
| 2022 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | — | conf |
CVPR Workshops
|
| 2021 | — | conf |
MLCAD
|
| 2021 | J | jnl |
CoRR
|
| 2021 | — | conf |
CVPR Workshops
|
| 2021 | J | jnl |
CoRR
|
| 2021 | Misc | conf |
CODES+ISSS
|
| 2021 | A | conf |
BMVC
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
Ad Hoc Networks
|
| 2021 | J | jnl |
CoRR
|
| 2021 | — | conf |
CCNC
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | — | conf |
ENSsys@SenSys
|
| 2020 | J | jnl |
IEEE Trans. Computers
|
| 2020 | — | conf |
ENSsys@SenSys
|
| 2020 | J | jnl |
IEEE Des. Test
|
| 2020 | B | conf |
WCNC
|
| 2020 | — | conf |
ENSsys@SenSys
|
| 2020 | B | conf |
ISPASS
|
| 2020 | J | jnl |
IEEE Internet Things Mag.
|
| 2020 | A | conf |
DATE
|
| 2019 | C | conf |
ISCAS
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | A* | conf |
HPCA
|
| 2019 | A* | conf |
DAC
|
| 2019 | — | conf |
WF-IoT
|
| 2019 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2019 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2019 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2019 | J | jnl |
Sustain. Comput. Informatics Syst.
|
| 2019 | A | conf |
ICSOC
|
| 2018 | J | jnl |
J. Syst. Archit.
|
| 2018 | — | conf |
PECCS
|
| 2018 | Misc | conf |
SenSys
|
| 2018 | — | conf |
SmartGridComm
|
| 2018 | — | conf |
ENSsys@SenSys
|
| 2018 | — | conf |
IGSC
|
| 2018 | B | conf |
ISPASS
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2018 | J | jnl |
IEEE Trans. Multi Scale Comput. Syst.
|
| 2018 | J | jnl |
Future Gener. Comput. Syst.
|
| 2018 | A | conf |
DATE
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
Sensors
|
| 2018 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2018 | — | conf |
HPCS
|
| 2017 | — | conf |
ENSsys@SenSys
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | — | conf |
ENSsys@SenSys
|
| 2017 | Misc | conf |
SenSys
|
| 2017 | — | conf |
PATMOS
|
| 2017 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2017 | A | conf |
DATE
|
| 2017 | — | conf |
IWASI
|
| 2017 | — | conf |
DFT
|
| 2017 | J | jnl |
J. Low Power Electron.
|
| 2017 | A | conf |
DATE
|
| 2017 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2017 | A | conf |
ISLPED
|
| 2017 | A | conf |
DATE
|
| 2017 | — | conf |
ESTIMedia
|
| 2017 | Misc | conf |
SoftCOM
|
| 2016 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2016 | — | conf |
EWME
|
| 2016 | B | conf |
SAS
|
| 2016 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | — | conf |
EWME
|
| 2016 | A* | conf |
DAC
|
| 2016 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | A | conf |
DATE
|
| 2016 | — | conf |
PATMOS
|
| 2016 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2015 | — | conf |
SpringSim (TMS-DEVS)
|
| 2015 | J | jnl |
Comput. Electr. Eng.
|
| 2015 | — | conf |
PARMA-DITAM@HiPEAC
|
| 2015 | — | conf |
PATMOS
|
| 2015 | C | conf |
RSP
|
| 2015 | — | conf |
ENSsys@SenSys
|
| 2015 | B | conf |
SAS
|
| 2015 | Misc | conf |
SenSys
|
| 2015 | B | conf |
SAS
|
| 2015 | — | conf |
ENSsys@SenSys
|
| 2015 | A | conf |
ISLPED
|
| 2015 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2015 | Misc | conf |
SenSys
|
| 2015 | Misc | conf |
SenSys
|
| 2015 | J | jnl |
Comput. Electron. Agric.
|
| 2015 | — | ed. |
ENSsys@SenSys
|
| 2015 | — | conf |
MCSoC
|
| 2015 | A | conf |
DATE
|
| 2014 | J | jnl |
Electron. Commun. Eur. Assoc. Softw. Sci. Technol.
|
| 2014 | J | jnl |
J. Artif. Intell. Res.
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | — | conf |
ENSsys@SenSys
|
| 2014 | — | conf |
ENSsys@SenSys
|
| 2014 | — | conf |
PerCom Workshops
|
| 2014 | A* | conf |
CHI
|
| 2014 | — | ed. |
ENSsys@SenSys
|
| 2014 | A* | conf |
DAC
|
| 2013 | A* | conf |
IJCAI
|
| 2013 | A | conf |
DATE
|
| 2013 | — | conf |
SESENA
|
| 2013 | A | conf |
DATE
|
| 2013 | B | conf |
ICCCN
|
| 2013 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2013 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2013 | B | conf |
ICCCN
|
| 2013 | — | conf |
ENSSys@SenSys
|
| 2013 | — | ed. |
ENSSys@SenSys
|
| 2013 | — | conf |
ENSSys@SenSys
|
| 2012 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2012 | — | conf |
INSS
|
| 2012 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2012 | — | conf |
INSS
|
| 2012 | — | conf |
SESENA
|
| 2011 | — | conf |
MobileHealth@MobiHoc
|
| 2011 | A | conf |
DATE
|
| 2011 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2011 | A | conf |
DATE
|
| 2009 | B | conf |
SECON
|
| 2008 | B | conf |
ICCCN
|
| 2008 | B | conf |
ICCCN
|
| 2008 | — | — |
|
| 2008 | B | conf |
ICCCN
|
| 2004 | — | conf |
PATMOS
|