| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | J | jnl |
Clust. Comput.
|
| 2025 | Misc | conf |
ICASSP
|
| 2025 | Misc | conf |
ICASSP
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Serv. Comput.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2025 | J | jnl |
J. Comput. Methods Sci. Eng.
|
| 2025 | Misc | conf |
ICASSP
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
Expert Syst. Appl.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
J. Real Time Image Process.
|
| 2024 | J | jnl |
IEEE Signal Process. Lett.
|
| 2024 | J | jnl |
Complex Intell. Syst.
|
| 2024 | — | conf |
CCBR (2)
|
| 2024 | Misc | conf |
ICASSP
|
| 2024 | J | jnl |
Frontiers Comput. Sci.
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | — | conf |
ISCSLP
|
| 2024 | Misc | conf |
ICASSP
|
| 2024 | J | jnl |
Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks.
J. Circuits Syst. Comput.
|
| 2023 | J | jnl |
Appl. Intell.
|
| 2023 | J | jnl |
Appl. Intell.
|
| 2023 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2023 | J | jnl |
Knowl. Based Syst.
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | — | conf |
HPCC/DSS/SmartCity/DependSys
|
| 2023 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2023 | J | jnl |
J. Comput. Methods Sci. Eng.
|
| 2022 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2022 | J | jnl |
J. Intell. Fuzzy Syst.
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2022 | J | jnl |
Int. J. Comput. Math.
|
| 2022 | — | conf |
EMBC
|
| 2022 | — | conf |
ICONIP (2)
|
| 2022 | — | conf |
MMM (1)
|
| 2022 | — | conf |
AHPCAI
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2021 | B | conf |
IJCNN
|
| 2020 | J | jnl |
Comput. Math. Appl.
|
| 2020 | J | jnl |
Remote. Sens.
|
| 2020 | J | jnl |
ACM Trans. Graph.
|
| 2020 | — | conf |
WI/IAT
|
| 2019 | J | jnl |
Ecol. Informatics
|
| 2019 | — | conf |
ISPA/BDCloud/SocialCom/SustainCom
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
Comput. Electr. Eng.
|
| 2017 | J | jnl |
Microelectron. J.
|
| 2016 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2016 | J | jnl |
Ecol. Informatics
|
| 2016 | J | jnl |
Robotica
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2016 | — | conf |
3PGCIC
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2015 | J | jnl |
IEEE Trans. Image Process.
|
| 2015 | J | jnl |
J. Circuits Syst. Comput.
|
| 2015 | J | jnl |
IEICE Electron. Express
|
| 2015 | — | conf |
ICIRA (2)
|
| 2015 | J | jnl |
IEICE Electron. Express
|
| 2015 | J | jnl |
J. Math. Imaging Vis.
|
| 2015 | — | conf |
CCTA (2)
|
| 2014 | J | jnl |
IEICE Electron. Express
|
| 2013 | J | jnl |
Microelectron. J.
|
| 2012 | — | conf |
ICIRA (1)
|
| 2012 | — | conf |
BIFE
|
| 2011 | J | jnl |
J. Intell. Manuf.
|
| 2011 | — | conf |
IVMSP
|
| 2010 | Misc | conf |
ICCS
|
| 2009 | — | conf |
CSO (2)
|
| 2008 | B | conf |
ACIVS
|
| 2007 | J | jnl |
J. Electronic Imaging
|
| 2007 | J | jnl |
IEEE Signal Process. Lett.
|
| 2006 | B | conf |
ICIP
|
| 2006 | B | conf |
ICIP
|
| 2006 | — | conf |
Quantitative cell motility for in vitro wound healing using level set-based active contour tracking.
ISBI
|
| 2005 | — | conf |
ISQED
|
| 2005 | J | jnl |
IEEE Trans. Medical Imaging
|
| 2005 | — | conf |
ISQED
|
| 2005 | — | conf |
ICIP (1)
|
| 2004 | B | conf |
CBMS
|
| 2003 | — | conf |
ICIP (2)
|
| 1994 | Misc | conf |
MVA
|