G. Q. Zhang - RankMe

55 papers A 1Misc 1Journal 48Unranked 5

Year	Rank	Type	Title / Venue / Authors
2025	J	`jnl`	SDGMPS: A spin-dependent Glauber model program for elastic proton-nucleus scattering. Comput. Phys. Commun. Jingtao Zhang, Xiaolin Tu, Y. Huang, L. Y. Li, G. Q. Zhang, Zenghua Li
2024	A	`conf`	AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation. ITC Varun Thukral, Chen He, Rebecca Chen, Letian Zhang, Romuald Roucou, Michiel van Soestbergen, Jeroen J. M. Zaal, Rene Rongen, Willem D. van Driel, G. Q. Zhang
2020	—	`conf`	Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors. ISIE Luke M. Middelburg, Mohammadamir Ghaderi, David Bilby, Jacobus H. Visser, G. Q. Zhang, Reinoud F. Wolffenbuttel
2019	J	`jnl`	Open Source Software Sustainability Models: Initial White Paper from the Information Technology for Cancer Research Sustainability and Industry Partnership Work Group. CoRR Y. Ye, Richard D. Boyce, M. K. Davis, Keith O. Elliston, Christos Davatzikos, Andrey Fedorov, Jean-Christophe Fillion-Robin, Ian T. Foster, John R. Gilbertson, Mervi Heiskanen, Juli D. Klemm, Andras Lasso, James V. Miller, M. Morgan, Steve Pieper, Brigitte Raumann, B. Sarachan, G. Savova, Jonathan C. Silverstein, D. Taylor, J. Zelnis, G. Q. Zhang, Michael J. Becich
2019	—	`conf`	Recessed gate Pt-AlGaN/GaN HEMT H2 sensor. IEEE SENSORS Robert Sokolovskij, J. Zhang, H. Zheng, W. Li, Yang Jiang, G. Yang, Hongyu Yu, Pasqualina M. Sarro, G. Q. Zhang
2018	J	`jnl`	A review on discoloration and high accelerated testing of optical materials in LED based-products. Microelectron. Reliab. M. Yazdan Mehr, Mohammad Reza Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang
2017	J	`jnl`	Color shift acceleration on mid-power LED packages. Microelectron. Reliab. Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang
2017	—	`conf`	High aspect ratio spiral resonators for process variation investigation and MEMS applications. IEEE SENSORS Luke M. Middelburg, Brahim El Mansouri, Henk W. van Zeijl, G. Q. Zhang, R. H. Poelma
2017	J	`jnl`	Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products. Microelectron. Reliab. M. Yazdan Mehr, Mohammad Reza Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang
2016	J	`jnl`	Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test. Reliab. Eng. Syst. Saf. Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang
2015	J	`jnl`	Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests. Microelectron. Reliab. Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang
2014	J	`jnl`	Accelerated life time testing and optical degradation of remote phosphor plates. Microelectron. Reliab. M. Yazdan Mehr, Willem D. van Driel, G. Q. Zhang
2014	—	`conf`	Blue selective photodiodes for optical feedback in LED wafer level packages. ESSDERC Zahra Kolahdouz Esfahani, Teng Ma, Henk W. van Zeijl, G. Q. Zhang, Ali Rostamian, Mohammadreza Kolahdouz
2014	J	`jnl`	Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products. Microelectron. Reliab. M. Yazdan Mehr, W. D. van Driel, Kaspar M. B. Jansen, P. Deeben, G. Q. Zhang
2014	J	`jnl`	Multi-physics reliability simulation for solid state lighting drivers. Microelectron. Reliab. S. Tarashioon, W. D. van Driel, G. Q. Zhang
2013	J	`jnl`	A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectron. Reliab. Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang
2013	—	`conf`	Carbon Nanotube based heat-sink for solid state lighting. NEMS F. Santagata, G. Almanno, Sten Vollebregt, Cinzia Silvestri, G. Q. Zhang, Pasqualina M. Sarro
2012	Misc	`conf`	A Distributed Semantic Web Approach for Cohort Identification. AMIA Joseph Teagno, Richard C. Kiefer, Jyotishman Pathak, G. Q. Zhang, Satya Sanket Sahoo
2012	J	`jnl`	An approach to "Design for Reliability" in solid state lighting systems at high temperatures. Microelectron. Reliab. S. Tarashioon, Alessandro Baiano, Henk W. van Zeijl, C. Guo, S. W. Koh, W. D. van Driel, G. Q. Zhang
2012	J	`jnl`	Effects of single vacancy defect position on the stability of carbon nanotubes. Microelectron. Reliab. R. H. Poelma, H. Sadeghian, Sau Koh, G. Q. Zhang
2010	J	`jnl`	A fast moisture sensitivity level qualification method. Microelectron. Reliab. Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
2010	J	`jnl`	Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang
2009	J	`jnl`	Comparing drop impact test method using strain gauge measurements. Microelectron. Reliab. Y. Liu, F. J. H. G. Kessels, Willem D. van Driel, J. A. S. van Driel, F. L. Sun, G. Q. Zhang
2009	J	`jnl`	Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectron. Reliab. Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang
2009	J	`jnl`	Numerical prediction of failure paths at a roughened metal/polymer interface. Microelectron. Reliab. S. P. M. Noijen, Olaf van der Sluis, P. H. M. Timmermans, G. Q. Zhang
2009	J	`jnl`	Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang
2008	J	`jnl`	Failure analysis of a thin-film nitride MEMS package. Microelectron. Reliab. Q. Li, J. F. L. Goosen, J. T. M. van Beek, Fred van Keulen, K. L. Phan, G. Q. Zhang
2008	J	`jnl`	On chip-package stress interaction. Microelectron. Reliab. W. D. van Driel, Dao-Guo Yang, G. Q. Zhang
2008	J	`jnl`	Packaging influences on the reliability of MEMS resonators. Microelectron. Reliab. Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang
2007	J	`jnl`	Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectron. Reliab. Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
2007	J	`jnl`	Advanced structural similarity rules for the BGA package family. Microelectron. Reliab. W. D. van Driel, A. Mavinkurve, Marcel A. J. van Gils, G. Q. Zhang
2007	J	`jnl`	Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken
2007	J	`jnl`	Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang
2007	J	`jnl`	Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectron. Reliab. H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang
2007	J	`jnl`	Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
2007	J	`jnl`	Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectron. Reliab. Viktor Gonda, Kaspar M. B. Jansen, Leo J. Ernst, Jaap M. J. den Toonder, G. Q. Zhang
2007	J	`jnl`	Novel shear tools for viscoelastic characterization of packaging polymers. Microelectron. Reliab. C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers
2007	J	`jnl`	Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
2007	J	`jnl`	Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
2006	J	`jnl`	Combining path relinking and genetic algorithms for the multiple-level warehouse layout problem. Eur. J. Oper. Res. G. Q. Zhang, K. K. Lai
2006	J	`jnl`	Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang
2006	J	`jnl`	Multiscale modelling of multilayer substrates. Microelectron. Reliab. R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang
2006	J	`jnl`	Reliability challenges in the nanoelectronics era. Microelectron. Reliab. A. J. van Roosmalen, G. Q. Zhang
2006	J	`jnl`	Reliability modelling for packages in flexible end-products. Microelectron. Reliab. W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
2005	J	`jnl`	Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectron. Reliab. W. D. van Driel, Marcel A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang
2004	J	`jnl`	Characterization and Modelling of Moisture Driven Interface Failures. Microelectron. Reliab. Marcel A. J. van Gils, P. J. J. H. A. Habets, G. Q. Zhang, Willem D. van Driel, Piet J. G. Schreurs
2004	J	`jnl`	Characterization and fatigue damage simulation in SAC solder joints. Microelectron. Reliab. Müge Erinc, Piet J. G. Schreurs, G. Q. Zhang, Marc G. D. Geers
2004	J	`jnl`	Integrated thermo-mechanical design and qualification of wafer backend structures. Microelectron. Reliab. G. Q. Zhang, Jaap Bisschop
2004	J	`jnl`	Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling. Microelectron. Reliab. Xuejun Fan, Jiang Zhou, G. Q. Zhang
2004	J	`jnl`	Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectron. Reliab. Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang
2004	J	`jnl`	Prediction of crack growth in IC passivation layers. Microelectron. Reliab. Y. T. He, Marcel A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst
2004	J	`jnl`	Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst
2004	J	`jnl`	Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst
2003	J	`jnl`	Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi
2003	J	`jnl`	The challenges of virtual prototyping and qualification for future microelectronics. Microelectron. Reliab. G. Q. Zhang