| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Electron. Commer. Res.
|
| 2023 | J | jnl |
Sensors
|
| 2023 | — | conf |
CISP-BMEI
|
| 2023 | J | jnl |
Parallel Process. Lett.
|
| 2022 | J | jnl |
Sensors
|
| 2021 | — | conf |
BDSIC
|
| 2018 | J | jnl |
Comput. Graph.
|
| 2013 | J | jnl |
Enterp. Inf. Syst.
|
| 2012 | J | jnl |
Comput. Oper. Res.
|
| 2011 | B | conf |
SMC
|
| 2011 | B | conf |
SMC
|
| 2010 | C | conf |
CSCWD
|
| 2010 | B | conf |
SMC
|
| 2010 | C | conf |
CSCWD
|
| 2008 | C | conf |
CSCWD
|
| 2008 | — | conf |
ICWL
|
| 2008 | — | conf |
ICWL
|
| 2007 | — | conf |
CONFENIS (2)
|